{"id":3852,"date":"2022-09-30T07:31:34","date_gmt":"2022-09-30T07:31:34","guid":{"rendered":"https:\/\/hillmancurtis.com\/?p=3852"},"modified":"2023-03-16T08:10:38","modified_gmt":"2023-03-16T08:10:38","slug":"circuit-board-manufacturing","status":"publish","type":"post","link":"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/","title":{"rendered":"Circuit Board Manufacturing in a Nutshell   \u2013 \u2013   The Clear Overview"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_56_1 counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title \" >Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\" role=\"button\"><label for=\"item-663c38fc525b1\" ><span class=\"\"><span style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/label><input aria-label=\"Toggle\" aria-label=\"item-663c38fc525b1\"  type=\"checkbox\" id=\"item-663c38fc525b1\"><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 eztoc-toggle-hide-by-default' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#The_Printed_Circuit_Board_Production_Process\" title=\"The Printed Circuit Board Production Process\">The Printed Circuit Board Production Process<\/a><ul class='ez-toc-list-level-3'><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#The_Designing_Phase_of_Printed_Circuit_Boards\" title=\"The Designing Phase of Printed Circuit Boards\">The Designing Phase of Printed Circuit Boards<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Engineering_Questions_and_Design_Review\" title=\"Engineering Questions and Design Review\">Engineering Questions and Design Review<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Printing_Circuit_Boards\" title=\"Printing Circuit Boards\">Printing Circuit Boards<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Printing_Interior_Copper_Layer\" title=\"Printing Interior Copper Layer\">Printing Interior Copper Layer<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Etching_the_Core_or_Inner_layer_to_remove_any_Copper\" title=\"Etching the Core or Inner layer to remove any Copper\">Etching the Core or Inner layer to remove any Copper<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Layer_Alignment\" title=\"Layer Alignment\">Layer Alignment<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Automatic_Optical_Inspection\" title=\"Automatic Optical Inspection\">Automatic Optical Inspection<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Lamination_and_adding_a_Copper_Foil_to_the_Circuit_Board\" title=\"Lamination and adding a Copper Foil to the Circuit Board\">Lamination and adding a Copper Foil to the Circuit Board<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Drilling_Circuit_Boards\" title=\"Drilling Circuit Boards\">Drilling Circuit Boards<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#PCB_Plating\" title=\"PCB Plating\">PCB Plating<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Outer_Layer_Imaging\" title=\"Outer Layer Imaging\">Outer Layer Imaging<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Etching_the_Outer_Layer\" title=\"Etching the Outer Layer\">Etching the Outer Layer<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#External_Layer_AOI_and_Application_Steps\" title=\"External Layer AOI and Application Steps\">External Layer AOI and Application Steps<\/a><ul class='ez-toc-list-level-4'><li class='ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Solder_Mask_Application_PCB_Fabrication_Process\" title=\"Solder Mask Application PCB Fabrication Process\">Solder Mask Application PCB Fabrication Process<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-4'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Silkscreen_Application\" title=\"Silkscreen Application\">Silkscreen Application<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Finishing_the_Printed_Circuit_Board\" title=\"Finishing the Printed Circuit Board\">Finishing the Printed Circuit Board<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-18\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Electrical_Test_Profiling_Route_out_and_Quality_check\" title=\"Electrical Test, Profiling, Route out, and Quality check\">Electrical Test, Profiling, Route out, and Quality check<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-19\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/#Conclusion\" title=\"Conclusion\">Conclusion<\/a><\/li><\/ul><\/nav><\/div>\n\n<p>The circuit board manufacturing process needs complex procedures so as to achieve viable products that function correctly. And considering PCBs are the fundamental backbone of almost all <a href=\"https:\/\/hillmancurtis.com\/semiconductor-manufacturing-electronics-shaoxing-corp\/\">electronic components<\/a> in the market today, manufacturers in the PCB industry try their best not to mess up the <a href=\"https:\/\/hillmancurtis.com\/pcb-production\/\">PCB production<\/a> process.<\/p>\n\n\n\n<p>Printed <a href=\"https:\/\/hillmancurtis.com\/circuit-boards\/\">Circuit Boards<\/a> come in three varieties, single layer, double layer, and multi-layer <a href=\"https:\/\/hillmancurtis.com\/multilayer-flex-circuits\/\">Printed Circuit Boards<\/a>. Due to these structural differences, some Printed circuit Boards may need up to twenty steps or more to hit the finished product mark.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-content-justification-center is-layout-flex wp-container-core-buttons-layout-1 wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link\" href=\"https:\/\/hillmancurtis.com\/contact\/\"><strong>Request Circuit Board  Manufacturing  Quote Now<\/strong><\/a><\/div>\n<\/div>\n\n\n\n<p>The complexity of an actual PCB directly correlates to the number of stages that the PCB has to go through to complete the production phase. Therefore, Printed Circuit Boards bearing more layers than one must go through more production steps than those with only one layer.<\/p>\n\n\n\n<p>Moreover, cutting back or skipping any necessary PCB production steps negatively impacts the circuit board, rendering it useless or substandard which is something that a contract manufacturer and <a href=\"https:\/\/hillmancurtis.com\/printed-circuit-board-companies\/\">PCB companies<\/a> don&#8217;t like<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"576\" src=\"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/circuit-board-1024x576.jpg\" alt=\"\" class=\"wp-image-3854\" srcset=\"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/circuit-board-1024x576.jpg 1024w, https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/circuit-board-300x169.jpg 300w, https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/circuit-board-768x432.jpg 768w, https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/circuit-board-1536x864.jpg 1536w, https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/circuit-board-2048x1152.jpg 2048w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"The_Printed_Circuit_Board_Production_Process\"><\/span>The Printed Circuit Board Production Process<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>To ensure you get the production process right, you should ensure your PCB goes through the following stages:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"The_Designing_Phase_of_Printed_Circuit_Boards\"><\/span>The Designing Phase of Printed Circuit Boards<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The PCB designing phase is usually the first phase of a <a href=\"https:\/\/hillmancurtis.com\/pcb-manufacturing\/\">PCB manufacturing<\/a> process. In this phase, the <a href=\"https:\/\/hillmancurtis.com\/eagle-to-altium-conversion\/\">PCB designers<\/a> create a blueprint that satisfies the client&#8217;s requirements. To achieve this feat, designers primarily utilize software such as Extended Gerber (IX274X).&nbsp;<\/p>\n\n\n\n<p>When the designing phase is complete, the finished <a href=\"https:\/\/hillmancurtis.com\/pcb-design\/\">PCB design<\/a> is sent to the <a href=\"https:\/\/hillmancurtis.com\/pcb-fabrication-services\/\">Printed Circuit Board fabrication<\/a> house for the next step.<\/p>\n\n\n\n<p>Upon arrival at the fabrication house, the fabricators must verify that the <a href=\"https:\/\/hillmancurtis.com\/printed-circuit-board-design\/\">Printed Circuit Board design<\/a> surpasses the tolerances levels required for production. When the PCB design passes this test, it can move on to the second production phase.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Engineering_Questions_and_Design_Review\"><\/span>Engineering Questions and Design Review<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>In this step, a qualified engineer goes through the PCB design to ensure that it does not bear any flaws. To do so, the engineers must review all the components needed for the design to work. They also have to check the PCB structure in depth.<\/p>\n\n\n\n<p>After gaining clearance from the engineer, the PCB design moves on to the next phase.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Printing_Circuit_Boards\"><\/span>Printing Circuit Boards<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>&nbsp;After passing all the design phases, the PCB is ready for <a href=\"https:\/\/hillmancurtis.com\/pcb-printing\/\">printing<\/a>. However, unlike the engineering plans, PCB plans cannot be printed on 8.8 x 11 printing paper. Instead, a <a href=\"https:\/\/hillmancurtis.com\/printed-circuit-boards-manufacturing\/\">PCB manufacturer <\/a>has to utilize a special printer called a plotter.<\/p>\n\n\n\n<p>The plotter generates a PCB \u201cfilm,\u201d which is typically the PCB\u2019s photo negative.<\/p>\n\n\n\n<p>After printing the<a href=\"https:\/\/hillmancurtis.com\/bare-pcb\/\"> bare circuit board<\/a> film, the <a href=\"https:\/\/hillmancurtis.com\/pcb-manufacturer\/\">PCB manufacturer<\/a> then punches registration holes on the films, which are utilized for alignment purposes at a later stage.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Printing_Interior_Copper_Layer\"><\/span>Printing Interior Copper Layer<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>After printing the<a href=\"https:\/\/hillmancurtis.com\/top-10-pcb-design-and-manufacturing-supplier\/\"> circuit board design onto a laminate <\/a><a href=\"https:\/\/hillmancurtis.com\/electronic-components-on-pcb\/\">component<\/a>, PCB technicians have to pre-bind copper onto the laminate to help bring out the PCB\u2019s structure. They then etch out additional copper to bring out the PCB blueprint onto the laminate material.<\/p>\n\n\n\n<p>Next, they apply a photosensitive film known as resist onto the laminate panel to aid in the production of a structure that matches that of the PCB blueprint.<\/p>\n\n\n\n<p>After aligning the laminate and the resist, they utilize the premade holes to blast the two with UV light. The UV light goes through the film\u2019s translucent parts, hardening the resist.<\/p>\n\n\n\n<p>They then have to wash the PCB using an alkaline solution to help them remove the excess <a href=\"https:\/\/hillmancurtis.com\/photoresist-pcb\/\">photoresist<\/a>. Next, a technician pressure-washes the board to remove any dirt on it and then leave it dry.<\/p>\n\n\n\n<p>If no errors occur at this stage, the production process moves to the next phase.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-content-justification-center is-layout-flex wp-container-core-buttons-layout-2 wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link\" href=\"https:\/\/hillmancurtis.com\/contact\/\"><strong>Request Circuit Board  Manufacturing  Quote Now<\/strong><\/a><\/div>\n<\/div>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Etching_the_Core_or_Inner_layer_to_remove_any_Copper\"><\/span>Etching the Core or Inner layer to remove any Copper<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The inner layer(s) or core of the PCB must have all the unwanted copper ejected before proceeding to the next phase of production. To do so, <a href=\"https:\/\/hillmancurtis.com\/printed-circuit-board-manufacturers\/\">PCB manufacturers<\/a> utilize a process known as etching.<\/p>\n\n\n\n<p>Etching involves encasing the crucial copper parts on the board and leaving the unwanted exposed copper parts bare. The bare copper parts are then exposed to chemicals that etch out or remove them from the board leaving only the necessary copper parts.<\/p>\n\n\n\n<p>When this step is complete, the PCB manufacturing process moves on to the next stage.<\/p>\n\n\n\n<p>However, if the PCB is a multi-layer PCB, then it has to undergo extra steps to cater to the additional layers. These steps are:<\/p>\n\n\n\n<ul><li>Inner layer imaging \u2013 to produce the inner layer<\/li><li>Inner layer etching \u2013 technicians utilize a copper solvent to etch out exposed copper in the inner layers.<\/li><li>Resist stripping \u2013 involves encasing the copper using a photoresist<\/li><li>Post etch punch \u2013 to add in registration holes<\/li><li>Inner layer <a href=\"https:\/\/hillmancurtis.com\/aoi-pcb\/\">AOI<\/a> \u2013To examine the inner layer<\/li><li>Internal layer Oxide \u2013 for better bonding and it also acts as an insulating material<\/li><li>Lay-up \u2013 to help bond the layers<\/li><li>Lamination \u2013 to laminate the PCBs<\/li><li>X-ray alignment \u2013 to help cater to the drilling bit<\/li><\/ul>\n\n\n\n<p>When these steps are over, the multi-layer PCB can now move on to the next phase.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"1000\" height=\"500\" src=\"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/PCB-manufacturing.png\" alt=\"\" class=\"wp-image-3855\" srcset=\"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/PCB-manufacturing.png 1000w, https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/PCB-manufacturing-300x150.png 300w, https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/PCB-manufacturing-768x384.png 768w\" sizes=\"(max-width: 1000px) 100vw, 1000px\" \/><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Layer_Alignment\"><\/span>Layer Alignment<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>In this step, technicians utilize the registration holes to align the outer and inner layers. They do so using a punch machine that drives a pin through the holes lining up the <a href=\"https:\/\/hillmancurtis.com\/pcb-layers\/\">PCB layers<\/a>.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Automatic_Optical_Inspection\"><\/span>Automatic Optical Inspection<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The automated optical inspection (AOI) step, involves utilizing an optical inspection machine to look for defects in the PCB. If errors are found at this stage, they can be easily fixed.<\/p>\n\n\n\n<p>However, if no defects are found, the PCB manufacturing process moves on to the next stage.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Lamination_and_adding_a_Copper_Foil_to_the_Circuit_Board\"><\/span>Lamination and adding a Copper Foil to the Circuit Board<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The <a href=\"https:\/\/hillmancurtis.com\/pcb-material-types\/\">PCB lamination<\/a> process occurs in two distinct steps on a special press table using unique metal clamps:<\/p>\n\n\n\n<ul><li>The lay up<\/li><li>The lamination step<\/li><\/ul>\n\n\n\n<div class=\"wp-block-buttons is-content-justification-center is-layout-flex wp-container-core-buttons-layout-3 wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link\" href=\"https:\/\/hillmancurtis.com\/contact\/\"><strong>Request Circuit Board  Manufacturing  Quote Now<\/strong><\/a><\/div>\n<\/div>\n\n\n\n<p>The first step (lay-up) involves stacking the layers together, adding a thin copper foil that contains the boards copper traces on the substrate material and pressing onto them using a machine to merge them, generating a PCB stack.<\/p>\n\n\n\n<p>The second step involves utilizing heated plates to apply pressure and heat onto the PCB stack efficiently. The heat efficiently melts off the epoxy found inside the <a href=\"https:\/\/hillmancurtis.com\/prepreg-pcb\/\">prepreg<\/a> and the pressure exerted on the stack helps fuse the copper layers.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Drilling_Circuit_Boards\"><\/span>Drilling Circuit Boards<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"985\" height=\"500\" src=\"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/circuit-board-manufacturing.jpg\" alt=\"\" class=\"wp-image-3853\" srcset=\"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/circuit-board-manufacturing.jpg 985w, https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/circuit-board-manufacturing-300x152.jpg 300w, https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/09\/circuit-board-manufacturing-768x390.jpg 768w\" sizes=\"(max-width: 985px) 100vw, 985px\" \/><\/figure>\n\n\n\n<p>In this step, technicians utilize a special drill (one that is computer-aided) and the PCB&#8217;s blueprint to make holes in the PCB.<\/p>\n\n\n\n<p>Two types of vias are generated:<\/p>\n\n\n\n<ul><li>buried vias<\/li><li><a href=\"https:\/\/hillmancurtis.com\/blind-vias-pcb\/\">blind vias<\/a><\/li><\/ul>\n\n\n\n<p>Once the PCB drilling process is complete, any unwanted copper deposition on the board edges are filed off.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"PCB_Plating\"><\/span>PCB Plating<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The <a href=\"https:\/\/hillmancurtis.com\/pcb-edge-plating\/\">PCB plating<\/a> process involves using chemicals to fuse all the layers of the PCB efficiently.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Outer_Layer_Imaging\"><\/span>Outer Layer Imaging<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>In this step, technicians apply a layer of photoresist onto the external layer of the PCB. The process of application is similar to the internal one. However, technicians utilize tin plating for the exterior layer to help shield the copper during outer layer etching.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Etching_the_Outer_Layer\"><\/span>Etching the Outer Layer<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>During this procedure, excess copper is ejected from the PCB\u2019s outer layer using the earlier used copper solvent. The tin plating helps shield the copper ensuring that the process is smooth.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"External_Layer_AOI_and_Application_Steps\"><\/span>External Layer AOI and Application Steps<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<div class=\"wp-block-buttons is-content-justification-center is-layout-flex wp-container-core-buttons-layout-4 wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link\" href=\"https:\/\/hillmancurtis.com\/contact\/\">Request PCB Manufacturing &amp; Assembly Quote Now<\/a><\/div>\n<\/div>\n\n\n\n<p>After undergoing external etching, the PCB then has to go through external layer automated optical inspection to ensure that it meets all the necessary requirements such as hole spacing.<\/p>\n\n\n\n<p>After AOI verification, the PCB then moves on to the application steps:<\/p>\n\n\n\n<h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Solder_Mask_Application_PCB_Fabrication_Process\"><\/span><em>Solder Mask Application PCB Fabrication Process<\/em><em><\/em><span class=\"ez-toc-section-end\"><\/span><\/h4>\n\n\n\n<p>In this step, technicians carry out solder mask application to help protect the PCB against corrosion<\/p>\n\n\n\n<h4 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Silkscreen_Application\"><\/span><em>Silkscreen Application<\/em><em><\/em><span class=\"ez-toc-section-end\"><\/span><\/h4>\n\n\n\n<p>In this step technicians write crucial data onto the PCB directly. The information might include the PCB&#8217;s part number or the company&#8217;s ID number. The info comes in handy during <a href=\"https:\/\/hillmancurtis.com\/pcb-board-price\/\">assembly<\/a> for use in consumer electronics.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Finishing_the_Printed_Circuit_Board\"><\/span>Finishing the Printed Circuit Board<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Finishing up the Printed Circuit Board involves plating the PCB with conductive components such as:<\/p>\n\n\n\n<ul><li>Hard gold<\/li><li><a href=\"https:\/\/hillmancurtis.com\/immersion-silver-vs-immersion-tin-in-pcb\/\">Immersion silver<\/a><\/li><li>Lead-free <a href=\"https:\/\/hillmancurtis.com\/hasl-pcb\/\">HASL<\/a><\/li><\/ul>\n\n\n\n<p>Once this process is complete, the PCB can now move on to the next stage<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"1000\" height=\"522\" src=\"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/07\/FULL-PCB-MANUFACTURING-.jpg\" alt=\"\" class=\"wp-image-3373\" srcset=\"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/07\/FULL-PCB-MANUFACTURING-.jpg 1000w, https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/07\/FULL-PCB-MANUFACTURING--300x157.jpg 300w, https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/07\/FULL-PCB-MANUFACTURING--768x401.jpg 768w\" sizes=\"(max-width: 1000px) 100vw, 1000px\" \/><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Electrical_Test_Profiling_Route_out_and_Quality_check\"><\/span>Electrical Test, Profiling, Route out, and Quality check<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<div class=\"wp-block-buttons is-content-justification-center is-layout-flex wp-container-core-buttons-layout-5 wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link\" href=\"https:\/\/hillmancurtis.com\/contact\/\">Request PCB Manufacturing &amp; Assembly Quote Now<\/a><\/div>\n<\/div>\n\n\n\n<p>As the name dictates, the <a href=\"https:\/\/hillmancurtis.com\/electrical-testing\/\">electrical test<\/a> step involves testing the PCB&#8217;s electrical reliability. Once you pass this stage, the PCB can then move on to the profiling and route step, where technicians utilize Gerber files to identify the different sizes and shapes of the PCB. Doing so helps sort the PCB much more quickly for packaging.<\/p>\n\n\n\n<p>Finally, the quality check step involves checking the quality of the PCB. Once the PCB passes this step, is ready for <a href=\"https:\/\/hillmancurtis.com\/pcb-assembly\/\">PCB assembly<\/a>.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Conclusion<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>The PCB manufacturing process is a complex process that requires great care and attention to detail. When carried out correctly, the results are phenomenal, but when poorly done, the results are horrifying. Hence you should try your best to follow the steps in this article to manufacture your PCB.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The circuit board manufacturing process needs complex procedures so as to achieve viable products that function correctly. And considering PCBs are the fundamental backbone of almost all electronic components in the market today, manufacturers in the PCB industry try their best not to mess up the PCB production process. Printed Circuit Boards come in three &hellip;<\/p>\n<p class=\"read-more\"> <a class=\"\" href=\"https:\/\/hillmancurtis.com\/circuit-board-manufacturing\/\"> <span class=\"screen-reader-text\">Circuit Board Manufacturing in a Nutshell   \u2013 \u2013   The Clear Overview<\/span> Read More &raquo;<\/a><\/p>\n","protected":false},"author":2,"featured_media":2894,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"default","ast-global-header-display":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":null,"ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"","adv-header-id-meta":null,"stick-header-meta":null,"header-above-stick-meta":null,"header-main-stick-meta":null,"header-below-stick-meta":null,"footnotes":""},"categories":[13],"tags":[],"acf":[],"jetpack_featured_media_url":"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/05\/Shengyi-SF202-PCB.jpg","uagb_featured_image_src":{"full":["https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/05\/Shengyi-SF202-PCB.jpg",1000,600,false],"thumbnail":["https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/05\/Shengyi-SF202-PCB-150x150.jpg",150,150,true],"medium":["https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/05\/Shengyi-SF202-PCB-300x180.jpg",300,180,true],"medium_large":["https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/05\/Shengyi-SF202-PCB-768x461.jpg",768,461,true],"large":["https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/05\/Shengyi-SF202-PCB.jpg",1000,600,false],"1536x1536":["https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/05\/Shengyi-SF202-PCB.jpg",1000,600,false],"2048x2048":["https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/05\/Shengyi-SF202-PCB.jpg",1000,600,false],"woocommerce_thumbnail":["https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/05\/Shengyi-SF202-PCB-300x300.jpg",300,300,true],"woocommerce_single":["https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/05\/Shengyi-SF202-PCB.jpg",600,360,false],"woocommerce_gallery_thumbnail":["https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/05\/Shengyi-SF202-PCB-100x100.jpg",100,100,true],"yarpp-thumbnail":["https:\/\/hillmancurtis.com\/wp-content\/uploads\/2022\/05\/Shengyi-SF202-PCB-120x120.jpg",120,120,true]},"uagb_author_info":{"display_name":"Phoebe","author_link":"https:\/\/hillmancurtis.com\/author\/phoebe\/"},"uagb_comment_info":0,"uagb_excerpt":"The circuit board manufacturing process needs complex procedures so as to achieve viable products that function correctly. And considering PCBs are the fundamental backbone of almost all electronic components in the market today, manufacturers in the PCB industry try their best not to mess up the PCB production process. Printed Circuit Boards come in three&hellip;","_links":{"self":[{"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/posts\/3852"}],"collection":[{"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/comments?post=3852"}],"version-history":[{"count":7,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/posts\/3852\/revisions"}],"predecessor-version":[{"id":47361,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/posts\/3852\/revisions\/47361"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/media\/2894"}],"wp:attachment":[{"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/media?parent=3852"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/categories?post=3852"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/tags?post=3852"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}