{"id":50579,"date":"2023-06-05T02:24:25","date_gmt":"2023-06-05T02:24:25","guid":{"rendered":"https:\/\/hillmancurtis.com\/?p=50579"},"modified":"2023-06-05T02:24:27","modified_gmt":"2023-06-05T02:24:27","slug":"pcb-4-layer-design","status":"publish","type":"post","link":"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/","title":{"rendered":"4 Essential Tips for PCB 4 Layer Design"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_56_1 counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title \" >Table of Contents<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"Toggle Table of Content\" role=\"button\"><label for=\"item-6649110f221be\" ><span class=\"\"><span style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/label><input aria-label=\"Toggle\" aria-label=\"item-6649110f221be\"  type=\"checkbox\" id=\"item-6649110f221be\"><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1 eztoc-toggle-hide-by-default' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Benefits_of_4_Layer_PCB_Design\" title=\"Benefits of 4 Layer PCB Design\">Benefits of 4 Layer PCB Design<\/a><ul class='ez-toc-list-level-3'><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Improved_Signal_Integrity\" title=\"Improved Signal Integrity\">Improved Signal Integrity<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Reduced_Electromagnetic_Interference\" title=\"Reduced Electromagnetic Interference\">Reduced Electromagnetic Interference<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Higher_Component_Density\" title=\"Higher Component Density\">Higher Component Density<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Design_Considerations\" title=\"Design Considerations\">Design Considerations<\/a><ul class='ez-toc-list-level-3'><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Layer_Stackup\" title=\"Layer Stackup\">Layer Stackup<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Trace_Width_and_Spacing\" title=\"Trace Width and Spacing\">Trace Width and Spacing<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-8\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Via_Placement\" title=\"Via Placement\">Via Placement<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-9\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Manufacturing_Process\" title=\"Manufacturing Process\">Manufacturing Process<\/a><ul class='ez-toc-list-level-3'><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-10\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Drilling_and_Plating\" title=\"Drilling and Plating\">Drilling and Plating<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-11\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Lamination\" title=\"Lamination\">Lamination<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-12\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Etching\" title=\"Etching\">Etching<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-13\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Plating\" title=\"Plating\">Plating<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-14\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Testing_and_Validation\" title=\"Testing and Validation\">Testing and Validation<\/a><ul class='ez-toc-list-level-3'><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-15\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Electrical_Testing\" title=\"Electrical Testing\">Electrical Testing<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-16\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Signal_Integrity_Analysis\" title=\"Signal Integrity Analysis\">Signal Integrity Analysis<\/a><\/li><\/ul><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-17\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/#Conclusion\" title=\"Conclusion\">Conclusion<\/a><\/li><\/ul><\/nav><\/div>\n\n<p>PCB 4 layer design is a critical aspect of printed <a href=\"https:\/\/hillmancurtis.com\/circuit-boards\/\">circuit board<\/a> (PCB) production. It involves creating a PCB with four layers of copper traces, which are separated by insulating material. The design process is complex and requires a deep understanding of <a href=\"https:\/\/hillmancurtis.com\/pcb-manufacturing\/\">PCB manufacturing<\/a>, as well as the specific requirements of the circuit being designed.<\/p>\n\n\n\n<p>The use of four-layer PCBs has become increasingly popular over the years, due to their ability to handle more complex circuits and higher density designs. They are commonly used in applications such as telecommunications, computing, and medical devices. The additional layers provide more space for routing traces, which can help reduce noise and interference, as well as improve signal integrity. Additionally, the four-layer design can help reduce the size of the PCB, making it more compact and easier to fit into smaller devices.<\/p>\n\n\n\n<div class=\"wp-block-uagb-image uagb-block-7ade6a67 wp-block-uagb-image--layout-default wp-block-uagb-image--effect-static wp-block-uagb-image--align-none\"><figure class=\"wp-block-uagb-image__figure\"><img decoding=\"async\" srcset=\"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2023\/06\/STM32-PDB-Design-1024x427.jpg \" src=\"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2023\/06\/STM32-PDB-Design-1024x427.jpg\" alt=\"\" class=\"uag-image-50588\" title=\"\"\/><\/figure><\/div>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Benefits_of_4_Layer_PCB_Design\"><\/span>Benefits of 4 Layer PCB Design<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Improved_Signal_Integrity\"><\/span>Improved Signal Integrity<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>One of the main benefits of <a href=\"https:\/\/hillmancurtis.com\/4-layer-pcb\/\">4 layer PCB<\/a> design is improved signal integrity. With 4 layers, it is possible to separate the power and ground planes from the signal traces, which reduces the amount of noise and interference that can affect the signals. This leads to better signal quality and more reliable performance.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Reduced_Electromagnetic_Interference\"><\/span>Reduced Electromagnetic Interference<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Another benefit of 4 layer <a href=\"https:\/\/hillmancurtis.com\/pcb-design\/\">PCB design<\/a> is reduced electromagnetic interference. By separating the power and ground planes from the signal traces, it is possible to reduce the amount of electromagnetic interference that can affect the signals. This is particularly important in high-speed designs where even small amounts of interference can cause problems.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button aligncenter\"><a class=\"wp-block-button__link wp-element-button\" href=\"https:\/\/hillmancurtis.com\/contact\/\"><strong><strong><strong>Request PCB Manufacturing &amp; Assembly Quote Now<\/strong><\/strong><\/strong><\/a><\/div>\n<\/div>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Higher_Component_Density\"><\/span>Higher Component Density<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Finally, 4 layer PCB design allows for higher <a href=\"https:\/\/hillmancurtis.com\/electronic-components-on-pcb\/\">component<\/a> density. With more layers available, it is possible to place more components on the board without sacrificing signal quality or increasing the risk of interference. This can be particularly important in complex designs where space is at a premium.<\/p>\n\n\n\n<p>Overall, 4 layer PCB design offers a number of benefits over simpler designs. By improving signal integrity, reducing electromagnetic interference, and allowing for higher component density, it is possible to create more reliable and efficient PCBs that can meet the demands of even the most complex applications.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Design_Considerations\"><\/span>Design Considerations<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>When designing a PCB with four layers, there are several design considerations to keep in mind. These considerations include layer stackup, trace width and spacing, and via placement.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Layer_Stackup\"><\/span>Layer Stackup<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The layer stackup is the arrangement of the four layers in the PCB. The most common arrangement for a four-layer PCB is signal-ground-power-signal, where the signal layers are sandwiched between the ground and power planes. This arrangement provides good signal integrity and noise immunity.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Trace_Width_and_Spacing\"><\/span>Trace Width and Spacing<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The trace width and spacing are critical factors in a PCB design. The trace width and spacing determine the impedance of the traces and the amount of current they can carry. The trace width should be chosen based on the current carrying capacity of the trace, while the spacing should be chosen based on the voltage isolation requirements.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Via_Placement\"><\/span>Via Placement<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Vias are used to connect the different layers of the PCB. The placement of vias is critical to the performance of the PCB. Vias should be placed close to the components they are connecting, and they should be placed in a way that minimizes the impedance of the connection.<\/p>\n\n\n\n<p>In summary, when designing a four-layer PCB, it is important to consider the layer stackup, trace width and spacing, and via placement. By keeping these considerations in mind, you can create a PCB that performs well and meets the requirements of your project.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Manufacturing_Process\"><\/span>Manufacturing Process<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<div class=\"wp-block-uagb-image uagb-block-0dd44f99 wp-block-uagb-image--layout-default wp-block-uagb-image--effect-static wp-block-uagb-image--align-none\"><figure class=\"wp-block-uagb-image__figure\"><img decoding=\"async\" srcset=\"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2023\/02\/FULL-PCB-MANUFACTURING-1-2.jpg \" src=\"https:\/\/hillmancurtis.com\/wp-content\/uploads\/2023\/02\/FULL-PCB-MANUFACTURING-1-2.jpg\" alt=\"\" class=\"uag-image-46579\" title=\"\"\/><\/figure><\/div>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Drilling_and_Plating\"><\/span>Drilling and Plating<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The first step in PCB 4 layer design manufacturing is drilling and plating. Holes are drilled in the board, and a thin layer of copper is deposited on the surface. The holes are then plated with copper to create electrical connections between the layers.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Lamination\"><\/span>Lamination<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The next step in the manufacturing process is lamination. The layers of the board are laminated together using heat and pressure. This process creates a strong bond between the layers and ensures that the electrical connections between the layers are secure.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Etching\"><\/span>Etching<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>After lamination, the board is etched to remove the unwanted copper. The etching process is done using a chemical solution that dissolves the copper that is not needed. The remaining copper forms the traces and <a href=\"https:\/\/hillmancurtis.com\/pads-layout\/\">pads<\/a> on the board.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Plating\"><\/span>Plating<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>The final step in the manufacturing process is plating. A thin layer of gold or other metal is plated onto the surface of the board to protect the copper from oxidation and to improve the conductivity of the board.<\/p>\n\n\n\n<p>Overall, the manufacturing process for PCB 4 layer design is complex and requires a high level of precision and expertise. By following these steps, manufacturers can produce high-quality boards that meet the needs of their customers.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button aligncenter\"><a class=\"wp-block-button__link wp-element-button\" href=\"https:\/\/hillmancurtis.com\/contact\/\"><strong><strong><strong>Request PCB Manufacturing &amp; Assembly Quote Now<\/strong><\/strong><\/strong><\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Testing_and_Validation\"><\/span>Testing and Validation<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Electrical_Testing\"><\/span>Electrical Testing<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Before the PCB 4 layer design is manufactured, it is important to conduct <a href=\"https:\/\/hillmancurtis.com\/electrical-testing\/\">electrical testing<\/a> to ensure that the design is functioning as intended. Electrical testing includes checking for short circuits, open circuits, and continuity of all the traces. This testing is typically done using a multimeter or an automated testing machine.<\/p>\n\n\n\n<p>During the testing process, it is important to ensure that the power and ground planes are properly connected and that there are no breaks or gaps in the planes. Additionally, it is important to check that the voltage and current levels are within the specified limits.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Signal_Integrity_Analysis\"><\/span>Signal Integrity Analysis<span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<p>Signal integrity analysis is a critical step in the validation process of a PCB 4 layer design. The goal of signal integrity analysis is to ensure that the signals are transmitted with minimal distortion and interference. This is especially important for high-speed designs.<\/p>\n\n\n\n<p>Signal integrity analysis involves simulating the design using software tools to identify any potential issues such as reflections, crosstalk, and impedance mismatches. The simulation results are then used to optimize the design and make any necessary changes.<\/p>\n\n\n\n<p>Once the design has been optimized, it is important to perform signal integrity testing to validate the simulation results. This testing involves measuring the actual signals on the board and comparing them to the simulated results. If there are any discrepancies between the two, further optimization is required.<\/p>\n\n\n\n<p>In conclusion, testing and validation are critical steps in the PCB 4 layer design process. Electrical testing and signal integrity analysis are two important aspects of this process that help ensure the design is functioning as intended. By following these steps, designers can ensure that their designs are optimized for performance and reliability.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Conclusion<span class=\"ez-toc-section-end\"><\/span><\/h2>\n\n\n\n<p>In conclusion, a 4-layer PCB design offers a number of advantages over 2-layer and 3-layer designs. By distributing the components across multiple layers, it is possible to reduce the size of the board, improve signal integrity, and reduce the amount of noise and interference. This can lead to better performance and reliability.<\/p>\n\n\n\n<p>However, designing a 4-layer PCB requires careful planning and attention to detail. It is important to consider factors such as the placement of components, the routing of traces, and the use of ground planes and power planes. By following best practices and guidelines, it is possible to create a design that meets the requirements of the application and performs reliably.<\/p>\n\n\n\n<p>Some key considerations to keep in mind when designing a 4-layer PCB include:<\/p>\n\n\n\n<ul>\n<li>Use of ground and power planes to reduce noise and interference<\/li>\n\n\n\n<li>Careful placement of components to minimize signal paths and reduce crosstalk<\/li>\n\n\n\n<li>Use of high-quality materials and manufacturing processes to ensure reliability<\/li>\n\n\n\n<li>Thorough testing and validation to ensure that the design meets the requirements of the application<\/li>\n<\/ul>\n\n\n\n<p>Overall, a 4-layer PCB design can be an excellent choice for many applications. By following best practices and guidelines, it is possible to create a design that meets the requirements of the application and performs reliably.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>PCB 4 layer design is a critical aspect of printed circuit board (PCB) production. It involves creating a PCB with four layers of copper traces, which are separated by insulating material. The design process is complex and requires a deep understanding of PCB manufacturing, as well as the specific requirements of the circuit being designed. &hellip;<\/p>\n<p class=\"read-more\"> <a class=\"\" href=\"https:\/\/hillmancurtis.com\/pcb-4-layer-design\/\"> <span class=\"screen-reader-text\">4 Essential Tips for PCB 4 Layer Design<\/span> Read More &raquo;<\/a><\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"default","ast-global-header-display":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","footnotes":""},"categories":[1],"tags":[],"acf":[],"jetpack_featured_media_url":"","uagb_featured_image_src":{"full":false,"thumbnail":false,"medium":false,"medium_large":false,"large":false,"1536x1536":false,"2048x2048":false,"woocommerce_thumbnail":false,"woocommerce_single":false,"woocommerce_gallery_thumbnail":false,"yarpp-thumbnail":false},"uagb_author_info":{"display_name":"Judy","author_link":"https:\/\/hillmancurtis.com\/author\/judy\/"},"uagb_comment_info":0,"uagb_excerpt":"PCB 4 layer design is a critical aspect of printed circuit board (PCB) production. It involves creating a PCB with four layers of copper traces, which are separated by insulating material. The design process is complex and requires a deep understanding of PCB manufacturing, as well as the specific requirements of the circuit being designed.&hellip;","_links":{"self":[{"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/posts\/50579"}],"collection":[{"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/comments?post=50579"}],"version-history":[{"count":1,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/posts\/50579\/revisions"}],"predecessor-version":[{"id":50589,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/posts\/50579\/revisions\/50589"}],"wp:attachment":[{"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/media?parent=50579"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/categories?post=50579"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/hillmancurtis.com\/wp-json\/wp\/v2\/tags?post=50579"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}