LFE3-70EA-8FN672C ApplicationField
-Cloud Computing
-Internet of Things
-Artificial Intelligence
-Medical Equipment
-Consumer Electronics
-5G Technology
-Wireless Technology
-Industrial Control
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LFE3-70EA-8FN672C FAQ Chips
Q: Does the price of LFE3-70EA-8FN672C devices fluctuate frequently?
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Q: Where can I purchase Lattice LFE3-70 Development Boards, Evaluation Boards, or LatticeECP3 Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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Q: How can I obtain software development tools related to the Lattice FPGA platform?
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ICs LFE3-70EA-8FN672C Features
Higher Logic Density for Increased System Integration
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Xilinx LFE3-70EA-8FN672C Overview
The LatticeECP3��� third generation high value FPGA from Lattice Semiconductor offers the industry’s lowest power consumption and price of any SERDES-capable FPGA device. The LatticeECP3 FPGA family offers multiprotocol 3.2G SERDES with XAUI jitter compliance, DDR3 memory interfaces, powerful DSP capabilities, high density on-chip memory, and up to 149K LUTS – all with half the power consumption and half the price of competitive SERDES-capable FPGAs. These Lattice FPGAs also provide flexible, reliable, and secure configuration options such as dual-boot capability, bit-stream encryption, and TransFR field upgrade features. LatticeECP3��� devices are suitable for high-volume, high-speed, low-cost applications.
The Lattice Programmable Logic ICs series LFE3-70EA-8FN672C is FPGA – Field Programmable Gate Array 66.5K LUTs 380 I/O SERDES 1.2V -8 Speed, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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LFE3-70EA-8FN672C Tags integrated circuit
1. LatticeECP3 evaluation kit
2. LatticeECP3 starter kit
3. Lattice LFE3-70
4. LFE3-70 reference design
5. LFE3-70 evaluation board
6. Lattice LatticeECP3 development board
7. LFE3-70EA-8FN672C Datasheet PDF
8. LatticeECP3 LFE3-70
9. LFE3-70 reference design
Xilinx LFE3-70EA-8FN672C TechnicalAttributes
-Packaging Tray
-Distributed RAM 145 Kbit
-Operating Supply Current 18 mA
-Minimum Operating Temperature 0 C
-Maximum Operating Frequency 500 MHz
-Number of I/Os 380
-Mounting Style SMD/SMT
-Operating Supply Voltage 1.2 V
-Factory Pack Quantity 40
-Package / Case FPBGA-672
-Number of Gates 66.5 K
-Maximum Operating Temperature + 70 C
-Embedded Block RAM – EBR 4420 Kbit