XCV600E-6FG676C -Consumer Electronics -Internet of Things

XCV600E-6FG676C ApplicationField

-Industrial Control
-Wireless Technology
-Artificial Intelligence
-5G Technology
-Cloud Computing
-Internet of Things
-Medical Equipment
-Consumer Electronics

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ICs XCV600E-6FG676C Features

RF Data Converter Subsystem Overview

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Xilinx XCV600E-6FG676C Overview

The XCV600E-6FG676C delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 6-layer metal 0.18 μm CMOS process. These advances make Virtex-E FPGAs powerful and flexible alternatives to mask-programmed gate arrays. The Virtex-E family includes the nine members in XCV600E-6FG676C Datasheet.
Building on experience gained from Virtex FPGAs, the XCV600E-6FG676C is an evolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the Virtex-E family delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.
The Xilinx FPGAs series XCV600E-6FG676C is FPGA Virtex-E Family 186.624K Gates 15552 Cells 357MHz 0.18um Technology 1.8V 676Pin FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XCV600E-6FG676C Tags integrated circuit

1. Virtex-E 1.8V FPGAs evaluation kit
2. Virtex-E 1.8V FPGAs starter kit
3. XCV600E-6FG676C Datasheet PDF
4. XCV600E evaluation board
5. XCV600E reference design
6. Xilinx Virtex-E 1.8V FPGAs development board
7. XCV600E development board
8. Xilinx XCV600E
9. XCV600E evaluation board

Xilinx XCV600E-6FG676C TechnicalAttributes

-Mounting Type Surface Mount
-Number of Logic Elements/Cells 15552
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Voltage – Supply 1.71V ~ 1.89V
-Supplier Device Package 676-FCBGA (27×27)
-Number of LABs/CLBs 3456
-Number of I/O 444

-Total RAM Bits 294912
-Package / Case 676-BBGA, FCBGA

-Number of Gates 985882

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