The device XC3S50AN-5TQG144C hails from the Spartan-3A FPGA family. It is a high performance commercial only device. The device comes up with 144 pin Thin Quad Flat Pack (TQFP). Other devices from the Spartan-3A FPGA family includes XC3S200A, XC3S400A, XC3S700A, and XC3S1400A. The FPGA-3A family provides solution to design challenges usually present in electronic applications. The XC3S50AN-5TQG144C devices are capable to give extremely high performance with very low cost. Its suspend and hibernate modes help in reducing system power. These devices come up with multi voltage and multi standard interface pins. The XC3S50AN-5TQG144C devices are equipped with QUIETIO which helps in reduction of switching noise. These devices are fully compatible with 3.3V and come up with hot swap compliance. The devices are designed for more than 640 Mb/s rate of data transfer. The XC3S50AN-5TQG144C devices are designed with integrated terminal resistors (differential) and equipped and supported with increased two-fold data rate also called DDR which is supported up to 400 Mb/s. These devices come up with abundant and modifiable logic resources. XC3S50AN-5TQG144C devices have one column of block RAM. The block RAM contains a dedicated multiplier. The Digital Clock Meter in in these devices is positioned at the top. The Spartan-3A family exhibit rich routing network.
XC3S50AN-5TQG144C Properties:
XC3S50AN-5TQG144C devices come with Fine pitch Ball Grid Array also known as FBGA Array. XC3S50AN family is designed with 50K system gates having 1,584 equivalent logic cells. Configurable Logic Array of this family consists of 16 rows and 12 columns with total 176 CLBs (one CLB is equal to 4 slices thus making 704 total slices). The device comes up with 11K Distributed RAM bits having 54K blocked RAM bits. These devices are equipped with 3 dedicated multipliers and equipped with two Digital Clock Managers (DCMs) at the top. XC3S50AN-5TQG144C devices are designed with 108 User I/O and 50 differential I/O pairs. The device contains 144 pins having package type Thin Quad Flat Pack (TQFP). The XC3S50AN-5TQG144C devices can operate in temperatures ranging from 0°C to 85°C.
Quiescent Current Conditions:
The XC3S50AN-5TQG144C are designed for Quiescent VCCINT supply current of 20 mA, Quiescent VVCCO supply current of 2mA, and Quiescent VCCAUX supply current of 8 mA.
I/O Timings:
Clock to Output timings of XC3S50AN-5TQG144C devices are set between 3.18 ns to 3.42 ns with Digital Clock Manager (DCM) usage and 12 mA device is in use at fast slew rate. Similarly, these devices are equipped with output timings with settings between 4.59 ns to 5.02 ns with no Digital Clock Manager usage and 12 mA device is in use at fast slew rate. Digital Clock Manager jitter is included in all explained output timings.
Pin to Pin setup times for the IOB input path for XC3S50AN-5TQG144C devices are set between 2.45 ns to 2.68 ns with Digital Clock Manager (DCM) usage and no configured Input delay. While pin to pin setup times for the same device are set between 2.55 ns to 2.76 ns with no Digital Clock Manager (DCM) usage and with programmed input delay. Hold time for XC3S50AN-5TQG144C devices are set at -0.36 ns to -0.12 ns when DCM is in use with no programmed input delay and Hold time vary between -0.63 ns to -0.58 ns when no DCM is in use with programmed input delay.
