There are several easy ways to speed up your ROGERS TC350 Plus. The materials used in TC350 Plus laminates can reduce insertion loss while delivering higher thermal conductivity. These materials are also more reliable and have lower operating temperatures, essential in high-power applications. Follow these easy steps to make your ROGERS TC350 faster! You’ll be surprised by how much faster your TC350 can run!
TC350 Plus materials
The TC350 Plus seals are high-performance, thermally enhanced woven glass-reinforced composites. This new material is ideal for higher-power microwave applications due to its excellent thermal dissipation within a circuit board. Its advanced filler system also helps the composite achieve better drilling performance, reducing manufacturing costs. This is just one of the many benefits of TC350 Plus materials.
These new materials feature a mixture of lower insertion loss and loss tangent, along with fillers of high thermally conductive capability. These benefits are essential for higher-power applications while also delivering superior reliability. In addition, these TC350 Plus materials also reduce operating temperatures. This reduces operating temperatures and improves the overall efficiency of the IC. As a result, this technology can improve the performance of a wide range of electronic devices, including computers.
The TC350 Plus material has a higher dielectric constant than its predecessor. Unlike FR-4, Rogers’s material is more resistant to dielectric breakdown and is thus faster. It also has a lower dissipation factor, resulting in less signal loss. This makes it faster and more energy-efficient. If you want a high-performance TC350 Plus, consider PCBGOGO. It is the industry leader in low-cost PCB prototypes and assembly and specializes in high-quality and low-volume fabrication.
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Request ROGERS TC350 PCB Quote , Pls Send PCB Files to Sales@raypcb.com Now
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TC350 Plus laminates
These laminates are a new class of PTFE-based filled with ceramic with woven glass reinforcement composites. They provide a high-performance, cost-effective, thermally improved material with excellent mechanical drilling and thermal dissipation characteristics, making them ideal for microwave applications that require higher power. Additionally, these materials have high dielectric strength and are UL 94 V-0 rated for flammability.
TC350 Plus laminates bond to the ED copper foil using a special process. The result is an extremely fast and reliable lamination process. The lamination process must be fast and consistent to make a quality product. The laminates must be completely dry during the prepreg application, and the inner layer must be completely dry. Once the inner layer is dry, you can laminate it in less than a minute.
TC350 Plus laminates also help the TC350 perform better in the field. We term the new TC350 Plus laminates as faster in the field than the previous version of the TC350. They are made of CuClad 250 LX laminate and are available for $4 per piece. TC350 Plus laminates exhibit more accuracy than their predecessor.
Arlon TC350 material is a high-frequency, PTFT-based composite with woven fiberglass. It provides a high-quality, reliable PCB for many demanding applications. It can be manufactured in large panels and is suitable for multi-circuit layouts and low-cost unit production. This laminate material is also available with electro-deposited copper on one or both sides. Furthermore, it has a high-transition temperature and is easy to drill.
TC350 Plus laminates reduce insertion loss
TC350 Plus laminates offer an exceptional mixture of low insertion loss and tangent, thermally conductive fillers, and high thermal conductivity. These properties combine to give TC350 laminates high reliability and minimized operating temperature in applications that require high power. To read more about the advantages of TC350 Plus laminates, check out our article. You can also find other information about TC350 laminates here.
The advanced ceramic-filled PTFE-based woven-glass reinforced composite material can deliver high thermal conductivity. It can also reduce RF heating of the conductors and is suitable for high-power microwave applications. This material is also drill-friendly, thanks to its advanced filler system. The result is reduced manufacturing costs. You can find TC350 Plus laminates in thicknesses of 0.010″ to 60″ and are UL 94 V-0 certified.
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Request ROGERS TC350 PCB Quote , Pls Send PCB Files to Sales@raypcb.com Now
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TC350 Plus laminates increase thermal conductivity
Our company announced the release of TC350 Plus laminates, a PTFE-based ceramic-filled reinforced composite material with woven glass. These laminates increase thermal conductivity by up to 1.24 w/mK, making them ideal for high-power microwave applications. In addition, the materials’ enhanced drilling performance reduces manufacturing costs. As a result, these laminates are ideal for high-frequency circuit boards, such as amplifiers, couplers, and filters.
TC350 Plus materials are unique in their low tangent loss and insertion loss with high thermally conductive fillers. As a result, these laminates increase thermal conductivity and reliability, allowing users to improve product reliability by reducing operating temperatures exhibited in applications requiring high power. TC350 Plus laminates must be installed at lower temperatures than the board’s decomposition temperature for optimum thermal conductivity.
To maximize the thermal performance of a TC350 Plus laminate, we may apply a dry inner layer. The prepreg should be properly dried and cured at the desired lamination temperature. This prevents warping and void formation. Also, store the laminates in a cool, dry, flat, and dark location, avoiding direct sunlight and temperature extremes. If the inner layer of the laminate is not dry, it may be brittle and cause warping.
TC350 Plus laminates reduce RF heating
These laminates are helpful in various electrical and electronic products, including power dividers, amplifiers, couplers, and filters. These products apply to consumer and commercial markets and military and aerospace applications. The smooth electro-deposited copper foil cladding reduces conductors’ insertion loss and RF heating.
The laminates offer high thermal conductivity at 1.24W/mK, making them ideal for industrial heating and microwave applications. Furthermore, the ceramic filler system of the composite material enhances its drilling performance, resulting in reduced manufacturing costs. It is important to note that TC350 Plus laminates do not exhibit thermal bridging, but they provide excellent dielectric strength and thermal dissipation, ensuring that a device is robust and reliable.
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Request ROGERS TC350 PCB Quote , Pls Send PCB Files to Sales@raypcb.com Now
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Future of TC350 Plus laminates
The company is looking to develop a new aluminum-sheathed, silver-filled PTFE composite material. The company is already working with its customers on the new material.
TC350 Plus products are compatible with most automated equipment. They include e-lam and other dry lamination machines from Rayming PCB & Assembly. However, these machines may not be able to perform the former process of wetting the fiberglass outside the dryer or integrated dryer drying and fiberglass fiber moving capabilities.
Conclusion
TC350 Plus laminates offer a high degree of thermal conductivity and are ideal for high-power microwave applications. They are helpful in filters, transformers, and power dividers. These materials are also suitable for use in military and aerospace applications. This laminate material is also ideal for use in high-frequency circuits.
The laminates are compatible with most automated equipment, including e-lam and other dry lamination machines. However, these machines may not be able to perform the former process of wetting the fiberglass outside the dryer or integrated dryer drying and fiberglass fiber moving capabilities. Furthermore, laminates do not exhibit thermal bridging and therefore can withstand direct sunlight.
TC350 Plus laminates offer a high degree of thermal conductivity. Therefore, they are ideal for use in high-power microwave applications. These materials are also suitable for use in military and aerospace applications.
