XCR3256XL-12TQG144I ApplicationField
-Industrial Control
-Internet of Things
-Consumer Electronics
-Medical Equipment
-Cloud Computing
-5G Technology
-Wireless Technology
-Artificial Intelligence
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XCR3256XL-12TQG144I FAQ Chips
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ICs XCR3256XL-12TQG144I Features
Fast ISP programming times
Advanced system featuresIn-system programmingInput registersPredictable timing modelUp to 23 clocks available per function blockExcellent pin retention during design changesFull IEEE Standard 1149.1 boundary-scan (JTAG)Four global clocksEight product term control terms per function block
144-pin TQFP (120 user I/O pins)
In-system programming
5V tolerant I/O pins with 3.3V core supply
256-ball FBGA (164 user I/O)
Typical Standby Current of 18 μA at 25° C
Four global clocks
Ultra low power operation
System frequencies up to 154 MHz
Refer to the CoolRunner™ XPLA3 family data sheet (DS012) for architecture description
280-ball CS BGA (164 user I/O)
Eight product term control terms per function block
Full IEEE Standard 1149.1 boundary-scan (JTAG)
Programmable slew rate control per output
Port Enable pin for additional I/O
Available in small footprint packages144-pin TQFP (120 user I/O pins)208-pin PQFP (164 user I/O)256-ball FBGA (164 user I/O)280-ball CS BGA (164 user I/O)
208-pin PQFP (164 user I/O)
Fast Zero Power™ (FZP) CMOS design technology
Up to 23 clocks available per function block
Excellent pin retention during design changes
Input registers
256 macrocells with 6,000 usable gates
2.7V to 3.6V supply voltage at industrial grade voltage range
Low power 3.3V 256 macrocell CPLD
3.3V PCI electrical specification compatible outputs (no internal clamp diode on any input or I/O)
7.0 ns pin-to-pin logic delays
Optimized for 3.3V systemsUltra low power operationTypical Standby Current of 18 μA at 25° C5V tolerant I/O pins with 3.3V core supplyAdvanced 0.35 micron five layer metal EEPROM processFast Zero Power™ (FZP) CMOS design technology3.3V PCI electrical specification compatible outputs (no internal clamp diode on any input or I/O)
Security bit prevents unauthorized access
Predictable timing model
Advanced 0.35 micron five layer metal EEPROM process
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Xilinx XCR3256XL-12TQG144I Overview
Introduction
The Spartan@-ll Field-Programmable Gate Array family gives users high performance, abundant logic resources, and a rich feature set, all at an exceptionally low price. The six-member family offers densities ranging from 15,000 to 200,000 system gates, as shown in Table 1. System performance is supported up to 200 MHz. Features includeblock RAM(to 56K bits), distributed RAM(to 75,264 bits), 16 selectable I/O standards, and four DLLs. Fast, predictable interconnect means that successive design iterations continue to meet timing requirements.
The Spartan-lI family is a superior alternative to mask-programmed ASICs. The FPGA avoids the initial cost, lengthy development cycles, and inherent risk ofconventional ASICs. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary(impossible with ASICs).
Features
· Second generation ASIC replacement technology
-Densities as high as 5,292 logic cells with up to 200,000 system gates
-Streamlined features based on Virtex? FPGA architecture
-Unlimited reprogrammability
-Very low cost
-Cost-effective 0.18 micron process
· System level features
-SelectRAM TM hierarchical memory: 16bits/LUT distributed RAM Configurable 4K bit block RAM
· Fast interfaces to external RAM
-Fully PCI compliant
-Low-power segmented routing architecture
-Full readback ability for verification/observability
-Dedicated carry logic for high-speed arithmetic
-Efficient multiplier support
-Cascade chain for wide-input functions
-Abundant registers/latches with enable, set, reset
-Four dedicated DLLs for advanced clock control
-Four primary low-skew global clock distribution nets
-IEEE 1149.1 compatible boundary scan logic
·Versatile I/O and packaging
-Pb-free package options
-Low-cost packages available in all densities
-Family footprint compatibility in common packages
-16high-performance interface standards
-Hot swap Compact PCI friendly
-Zero hold time simplifies system timing
·Core logic powered at 2.5V and I/Os powered at 1.5V，2.5V，or 3.3V
·Fully supported by powerful XilinxISEdevelopment system
-Fully automatic mapping，placement，and routing
The Xilinx CPLDs series XCR3256XL-12TQG144I is XCR3256XL-12TQG144I CPLD, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XCR3256XL-12TQG144I Tags integrated circuit
1. XCR3256XL-12TQG144I Datasheet PDF
2. XCR3256XL development board
3. Macrocell CPLD XCR3256XL
4. Xilinx Macrocell CPLD development board
5. Xilinx XCR3256XL
6. XCR3256XL evaluation board
7. XCR3256XL reference design
8. Macrocell CPLD evaluation kit
9. Xilinx Macrocell CPLD development board
Xilinx XCR3256XL-12TQG144I TechnicalAttributes
-Number of Logic Elements/Blocks 16
-Mounting Type Surface Mount
-Supplier Device Package 144-TQFP (20×20)
-Number of Gates 6000
-Number of Macrocells 256
-Voltage Supply – Internal 2.7V ~ 3.6V
-Number of I/O 120
-Operating Temperature -40℃ ~ 85℃ (TA)
-Package / Case 144-LQFP
-Programmable Type In System Programmable (min 1K program/erase cycles)
-Delay Time tpd(1) Max 10.8ns
