BT PCB: Application, Properties, & Factors affecting Performance

BT means bismaleimide triazine. It is a special type of sheet for the lamination process. It is an integral part of the chip manufacturing industry. The process of chip packaging is a crucial step in the assembly of the printed circuit board. The raw materials that are important for the circuit systems are properly laminated and have more than one circuit layer for smooth functioning.

These layers are made of dried glass and some are made of special fiber cloth that is applied on the substrate of the chip fabrication process. Besides, there is another good material called bismaleimide triazine (BT) resin substrate that has been hardened thermally.

The material is also cost-efficient and these are remarkable for the thermal and electrical attributes. Such a resin is also crucial for the progress of the electronics sector. 

What is a BT PCB?

BT stands for bismaleimide triazine resin. It goes through a process of thermosetting resin and becomes a special resin for the production of printed circuit boards. The resin is produced with the help of a combination of BT and epoxy resins. The BT resins are present in abundance in this special combination.

These act as major raw materials for the production of circuit boards. There is also a cyanate ester present that helps in this process. There are different salient characteristics of BT resins. These have no parallel in the electrical properties and offer superb thermal resistance. These properties are crucial for the quality performance of semiconductors. These resins are affordable and make the future production of circuits also easier.

Due to this fact, this resin is becoming more than crucial for the electronics sector. It is also important for the chip packaging process. Before the existence of these resins, chip packaging was much of an expensive procedure. The former resins were ceramic and high-end which created more complications for the producers. When BT resins were introduced, these show excellent thermal and electrical conductance flawlessly. The resin was first launched in Japan and gained adulation around the globe gradually. The major benefit was its cost-efficient nature. The producers started to find the chip packaging process much easier due to the execution of this certain resin. 

Major Applications of BT PCB

There is a long list of applications of BT printed circuit boards. Some devices work with one chip while others need more of them. The developers and engineers know the art of using these chips to make future electronics smaller and more feasible for users to take advantage of in daily life.

For instance, today, upcoming smartphones are lighter and more stylish than before due to tech-based and advanced components present in their configuration. Same way, these chips are also getting more advanced for the excellent execution and integration of these chips. Some chips need additional components for becoming light in weight and slimmer.

In this case, the engineers rely on thicker common raw material that have the ability to reduce the gap among the traces present in the circuit system. The step of spacing is important for decreasing the space within a definite micron range. During the production of such circuits, it is important to avoid curvature and deformation that are caused by fluctuations in temperature ranges. The production process is a reliable regulator of cold and hot temperatures.

The chips must endure the temperature changes for smooth working. So this is why today producers are depending on BT to meet all these criteria. These chips are supportive of incessant contraction and expansion. There should be no early damage to these chips once they have been produced.

In this case, too, BT is reliable and has an impressively long life length. Semiconductors are also excellent devices that are used in multiple electronic equipment. BT also backs this industry and pushes it forward to keep up with cutting-edge technologies as well. 

Properties of BT Epoxy resin material

It is important to shed light on the properties of BT epoxy. These properties are behind its abundant implementation in electronics and other electrical devices. One major property is the thermal resistance and electrical conductance offered by this epoxy. Therefore it does not include any kind of lead in it and serves impressively for those circuit boards that are not made from lead. The devices that are multilayer also rely on this type of epoxy. Furthermore, BT epoxy is beneficial for temperature regulation that runs on a low dielectric constant. The substrate of this resin can enhance the quality and bond of interlinks that are present in the circuit system. Due to this reason high density devices can be produced and developed easily. Additional properties are:

  • Electromigration
  • Heat resistance
  • High thermal resistance
  • High heat resistance
  • Insulation resistance
  • Wettability and lesser melting viscosity
  • Ion migration resistance
  • Low thermal expansion
  • Glass transition temperature
  • Impressive dielectric range
  • Offers curing shrinkage and provides dimensional stability

Factors Affecting the Performance of BT PCB

BT resin can be weighed down on the basis of some factors. So that its performance can be evaluated when needed in some cases. The viscosity of the resin is variable on the basis of BMI and CE. Let’s have a look at the following factors that determine the performance of BT-made circuit boards.

·       Lead-free PCB assembly soldering technology

There are many producers of printed circuit boards that do not use lead in the soldering process. This is the backbone of this industry. If this technique is combined with a special reflow-type soldering process that is higher in temperature then it could be life changing turn for the future of this industry. 

·       Chip Packaging soil technology development

The former technique of packaging semiconductors includes BT laminate materials, connections of chips and frames of lead including gold wiring so that the linkage of the pads of aluminum becomes easier for application on the chips. There are different methods of packaging that are common for producers. These methods are crucial for the sustenance of portable devices and process of miniaturization. 

·       High frequency

Frequency is an important factor in the domains of information technology and communication. The evolution of mobile phones to smartphones is obvious. Similarly, the frequencies of different electronics have been changing for many years.


The printed circuit boards made from BT resin are a favorite for many producers and leading enterprises in this sector. These are famous for their electrical and thermal attributes. Such resins are also affordable and make different procedures feasible for the producers. 

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