A2F060M3E-1FGG256M ApplicationField
-Industrial Control
-Cloud Computing
-Wireless Technology
-Artificial Intelligence
-5G Technology
-Medical Equipment
-Internet of Things
-Consumer Electronics
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A2F060M3E-1FGG256M FAQ Chips
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ICs A2F060M3E-1FGG256M Features
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Xilinx A2F060M3E-1FGG256M Overview
The SmartFusion family of cSoCs builds on the technology first introduced with the Fusion mixed signal
FPGAs. SmartFusion cSoCs are made possible by integrating FPGA technology with programmable
high-performance analog and hardened ARM Cortex-M3 microcontroller blocks on a flash semiconductor
process. The SmartFusion cSoC takes its name from the fact that these three discrete technologies are
integrated on a single chip, enabling the lowest cost of ownership and smallest footprint solution to you.
The Microsemi Embedded – System On Chip (SoC) series A2F060M3E-1FGG256M is IC SOC CORTEX-M3 100MHZ 256FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
A2F060M3E-1FGG256M Tags integrated circuit
1. A2F060 development board
2. SmartFusion Customizable System-on-Chip starter kit
3. Microsemi A2F060
4. SmartFusion Customizable System-on-Chip evaluation kit
5. A2F060 reference design
6. A2F060 evaluation board
7. Microsemi SmartFusion Customizable System-on-Chip development board
8. A2F060M3E-1FGG256M Datasheet PDF
9. SmartFusion Customizable System-on-Chip evaluation kit
Xilinx A2F060M3E-1FGG256M TechnicalAttributes
-Core Processor ARM? Cortex?-M3
-Connectivity EBI/EMI, I2C, SPI, UART/USART
-Peripherals DMA, POR, WDT
-Supplier Device Package 256-FPBGA (17×17)
-Operating Temperature -55℃ ~ 125℃ (TJ)
-Speed 100MHz
-RAM Size 16KB
-Architecture MCU, FPGA
-Package / Case 256-LBGA
-Primary Attributes ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
-Flash Size 128KB