A3P1000-1FGG256M ApplicationField
-Consumer Electronics
-Industrial Control
-Internet of Things
-Cloud Computing
-5G Technology
-Artificial Intelligence
-Wireless Technology
-Medical Equipment
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A3P1000-1FGG256M FAQ Chips
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Q: How can I obtain software development tools related to the Microsemi FPGA platform?
A: The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
Q: Where can I purchase Microsemi A3P1000 Development Boards, Evaluation Boards, or FPGA ProASIC3 Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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ICs A3P1000-1FGG256M Features
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Xilinx A3P1000-1FGG256M Overview
ProASIC3, the third-generation family of Microsemi flash FPGAs, offers performance, density, and
features beyond those of the ProASICPLUS family. Nonvolatile flash technology gives ProASIC3 devices
the advantage of being a secure, low power, single-chip solution that is Instant On. ProASIC3 is
reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable
designers to create high-density systems using existing ASIC or FPGA design flows and tools.
ProASIC3 devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as
clock conditioning circuitry based on an integrated phase-locked loop (PLL). The A3P015 and A3P030
devices have no PLL or RAM support.
ProASIC3 devices have up to 1 million system gates, supported
with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os.
ProASIC3 devices support the ARM Cortex-M1 processor. The ARM-enabled devices have Microsemi
ordering numbers that begin with M1A3P (Cortex-M1) and do not support AES decryption.
A3P1000-1FGG256M Tags integrated circuit
1. FPGA ProASIC3 A3P1000
2. Microsemi A3P1000
3. A3P1000 development board
4. A3P1000 evaluation board
5. FPGA ProASIC3 evaluation kit
6. Microsemi FPGA ProASIC3 development board
7. A3P1000-1FGG256M Datasheet PDF
8. FPGA ProASIC3 starter kit
9. A3P1000 evaluation board
Xilinx A3P1000-1FGG256M TechnicalAttributes
-Supplier Device Package 256-FBGA (17×17)
-Mounting Type Surface Mount
-Package / Case 256-LBGA
-Operating Temperature -55℃ ~ 125℃ (TJ)
-Total RAM Bits 147456
-Number of I/O 177
-Voltage – Supply 1.14V ~ 1.575V
-Number of Gates 1000000
