A3P1000-2FG256M -Industrial Control -Wireless Technology

A3P1000-2FG256M ApplicationField

-Medical Equipment
-Internet of Things
-Artificial Intelligence
-Consumer Electronics
-Cloud Computing
-Wireless Technology
-5G Technology
-Industrial Control

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A3P1000-2FG256M FAQ Chips 

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Q: Where can I purchase Microsemi A3P1000 Development Boards, Evaluation Boards, or FPGA ProASIC3 Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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ICs A3P1000-2FG256M Features

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Xilinx A3P1000-2FG256M Overview

ProASIC3, the third-generation family of Microsemi flash FPGAs, offers performance, density, and
features beyond those of the ProASICPLUS family. Nonvolatile flash technology gives ProASIC3 devices
the advantage of being a secure, low power, single-chip solution that is Instant On. ProASIC3 is
reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable
designers to create high-density systems using existing ASIC or FPGA design flows and tools.

ProASIC3 devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as
clock conditioning circuitry based on an integrated phase-locked loop (PLL). The A3P015 and A3P030
devices have no PLL or RAM support.

ProASIC3 devices have up to 1 million system gates, supported
with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os.
ProASIC3 devices support the ARM Cortex-M1 processor. The ARM-enabled devices have Microsemi
ordering numbers that begin with M1A3P (Cortex-M1) and do not support AES decryption.

A3P1000-2FG256M Tags integrated circuit

1. Microsemi A3P1000
2. FPGA ProASIC3 A3P1000
3. Microsemi FPGA ProASIC3 development board
4. A3P1000 development board
5. A3P1000 reference design
6. FPGA ProASIC3 evaluation kit
7. A3P1000 evaluation board
8. A3P1000-2FG256M Datasheet PDF
9. A3P1000 development board

Xilinx A3P1000-2FG256M TechnicalAttributes

-Number of Gates 1000000
-Mounting Type Surface Mount
-Voltage – Supply 1.14V ~ 1.575V
-Operating Temperature -55℃ ~ 125℃ (TJ)
-Number of I/O 177

-Total RAM Bits 147456

-Package / Case 256-LBGA
-Supplier Device Package 256-FPBGA (17×17)

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