EP1S30F780C7 ApplicationField
-Cloud Computing
-Artificial Intelligence
-Consumer Electronics
-Industrial Control
-Internet of Things
-Medical Equipment
-5G Technology
-Wireless Technology
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EP1S30F780C7 FAQ Chips
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Q: How can I obtain software development tools related to the INTEL FPGA platform?
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ICs EP1S30F780C7 Features
EPC devices offer the following features:
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Xilinx EP1S30F780C7 Overview
Introduction
The Stratix® family of FPGAs is based on a 1.5-V, 0.13-µm, all-layer copper
SRAM process, with densities of up to 79,040 logic elements (LEs) and up
to 7.5 Mbits of RAM. Stratix devices offer up to 22 digital signal
processing (DSP) blocks with up to 176 (9-bit × 9-bit) embedded
multipliers, optimized for DSP applications that enable efficient
implementation of high-performance filters and multipliers. Stratix
devices support various I/O standards and also offer a complete clock
management solution with its hierarchical clock structure with up to
420-MHz performance and up to 12 phase-locked loops (PLLs).
Features
■ 10,570 to 79,040 LEs; see Table 1–1
■ Up to 7,427,520 RAM bits (928,440 bytes) available without reducing logic resources
■ TriMatrixTM memory consisting of three RAM block sizes to implement true dual-port memory and first-in first-out (FIFO) buffers
■ High-speed DSP blocks provide dedicated implementation of multipliers (faster than 300 MHz), multiply-accumulate functions,and finite impulse response (FIR) filters
■ Up to 16 global clocks with 22 clocking resources per device region
■ Up to 12 PLLs (four enhanced PLLs and eight fast PLLs) per device provide spread spectrum, programmable bandwidth, clock switchover, real-time PLL reconfiguration, and advanced multiplication and phase shifting
■ Support for numerous single-ended and differential I/O standards
■ High-speed differential I/O support on up to 116 channels with up to 80 channels optimized for 840 megabits per second (Mbps)
■ Support for high-speed networking and communications bus standards including RapidIO, UTOPIA IV, CSIX, HyperTransportTM technology, 10G Ethernet XSBI, SPI-4 Phase 2 (POS-PHY Level 4),and SFI-4
■ Differential on-chip termination support for LVDS
■ Support for high-speed external memory, including zero bus turnaround (ZBT) SRAM, quad data rate (QDR and QDRII) SRAM,double data rate (DDR) SDRAM, DDR fast cycle RAM (FCRAM),and single data rate (SDR) SDRAM
■ Support for 66-MHz PCI (64 and 32 bit) in -6 and faster speed-grade devices, support for 33-MHz PCI (64 and 32 bit) in -8 and faster speed-grade devices
■ Support for 133-MHz PCI-X 1.0 in -5 speed-grade devices
■ Support for 100-MHz PCI-X 1.0 in -6 and faster speed-grade devices
■ Support for 66-MHz PCI-X 1.0 in -7 speed-grade devices
■ Support for multiple intellectual property megafunctions from Altera MegaCore® functions and Altera Megafunction Partners Program (AMPPSM) megafunctions
■ Support for remote configuration updates
The INTEL Embedded – FPGAs (Field Programmable Gate Array) series EP1S30F780C7 is Stratix FPGA 30K FBGA-780, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
EP1S30F780C7 Tags integrated circuit
1. INTEL EP1S30
2. Stratix FPGAs starter kit
3. INTEL Stratix FPGAs development board
4. EP1S30 development board
5. Stratix FPGAs evaluation kit
6. EP1S30F780C7 Datasheet PDF
7. EP1S30 reference design
8. EP1S30 evaluation board
9. EP1S30 development board
Xilinx EP1S30F780C7 TechnicalAttributes
-Minimum Operating Temperature 0 C
-Package / Case FBGA-780
-Maximum Operating Frequency 66 MHz
-Packaging Tray
-Series Stratix
-Mounting Style SMD/SMT
-Number of I/Os 597
-Operating Supply Voltage 1.5 V to 3.3 V
-Distributed RAM 3.3 Mbit
-Maximum Operating Temperature + 70 C
-Number of Logic Blocks 3247
-Operating Supply Current 114 mA
