EP1S30F780C7N ApplicationField
-Cloud Computing
-Wireless Technology
-5G Technology
-Medical Equipment
-Artificial Intelligence
-Internet of Things
-Consumer Electronics
-Industrial Control
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EP1S30F780C7N FAQ Chips
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Q: Where can I purchase INTEL EP1S30 Development Boards, Evaluation Boards, or Stratix FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
Q: How can I obtain software development tools related to the INTEL FPGA platform?
A: Quartus Prime Modelsim is the corresponding programming software for FPGA produced by Altera/Intel. The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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ICs EP1S30F780C7N Features
EPC devices offer the following features:
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Xilinx EP1S30F780C7N Overview
How to Find
Information
This handbook provides comprehensive information about the Alterae Stratix family of devices.
How to Find You can find more information in the following ways: Information aThe Adobe Acrobat Find feature, which searches the text ofa PDF document. Click the binoculars toolbar icon to open the Find dialog box.Acrobat bookmarks, which serve as an additional table of contents in PDF documents.
■Thumbnail icons, which provide miniature previews of each page, provide a link to the pages.Numerous links, shown in green text, which allow you to jump to related information.
Features
Stratix devices are available in space-saving FineLine BGA® and ball-grid array (BGA) packages (see Tables 1–3 through 1–5). All Stratix devices support vertical migration within the same package (for example, you can migrate between the EP1S10, EP1S20, and EP1S25 devices in the 672-pin BGA package).
Vertical migration means that you can migrate to devices whose dedicated pins, configuration pins, and power pins are the
same for a given package across device densities. For I/O pin migration across densities, you must cross-reference the available I/O pins using the device pin-outs for all planned densities of a given package type to identify which I/O pins are migrational. The Quartus® II software can
automatically cross reference and place all pins except differential pins for migration when given a device migration list. You must use the pinouts for each device to verify the differential placement migration. A future version of the Quartus II software will support differential pin migration.
Stratixe devices contain a two-dimensional row-and column-based architecture to implement custom logic.A series of column and row interconnects of varying length and speed provide signal interconnects between logic array blocks (LABs), memory block structures, and DSP blocks.
The logic array consists of LABs, with 10 logic elements (LEs) in each LAB. An LE is a small unit of logic providing efficient implementation of user logic functions. LABs are grouped into rows and columns across the device.
M512 RAM blocks are simple dual-port memory blocks with 512 bits plus parity (576 bits). These blocks provide dedicated simple dual-port or single-port memory up to 18-bits wide at up to 318 MHz.M512 blocks are grouped into columns across the device in between certain LABs.
M4K RAM blocks are true dual-port memory blocks with 4K bits plus parity(4,608 bits). These blocks provide dedicated true dual-port, simple dual-port, or single-port memory up to 36-bits wide at up to 291MHz.
These blocks are grouped into columns across the device in between certain LABs.
M-RAM blocks are true dual-port memory blocks with 512K bits plus parity(589,824 bits). These blocks provide dedicated true dual-port, simple dual-port, or single-port memory up to 144-bits wide at up to
269MHz. Several M-RAM blocks are located individually or in pairs within the device’s logic array.
Digital signal processing(DSP) blocks can implement up to either eight full-precision 9× 9-bit multipliers, four full-precision 18× 18-bit multipliers, or one full-precision 36× 36-bit multiplier with add or subtract features. These blocks also contain 18-bit input shift registers for digital signal processing applications, including FIR and infinite impulse response(IR) filters. DSP blocks are grouped into two columns in each device.
Each Stratix device I/O pin is fed by an I/O element 1OE) located at the end of LAB rows and columns around the periphery of the device.I/Opins support numerous single-ended and differential I/O standards. Each IOE contains a bidirectional 1/O buffer and six registers for registering input, output, and output-enable signals. When used with
The INTEL Embedded – FPGAs (Field Programmable Gate Array) series EP1S30F780C7N is FPGA Stratix Family 32470 Cells 420.17MHz 130nm Technology 1.5V 780-Pin FC-FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
EP1S30F780C7N Tags integrated circuit
1. EP1S30 evaluation board
2. EP1S30 development board
3. Stratix FPGAs evaluation kit
4. INTEL EP1S30
5. Stratix FPGAs starter kit
6. Stratix FPGAs EP1S30
7. EP1S30 reference design
8. INTEL Stratix FPGAs development board
9. INTEL EP1S30
Xilinx EP1S30F780C7N TechnicalAttributes
-Operating Supply Voltage 1.5 V to 3.3 V
-Minimum Operating Temperature 0 C
-Number of Logic Blocks 3247
-Series Stratix
-Maximum Operating Temperature + 70 C
-Distributed RAM 3.3 Mbit
-Mounting Style SMD/SMT
-Maximum Operating Frequency 66 MHz
-Packaging Tray
-Package / Case FBGA-780
-Number of I/Os 597
-Operating Supply Current 114 mA
