EP2A70F1020C9 ApplicationField
-Wireless Technology
-Consumer Electronics
-Industrial Control
-Medical Equipment
-Internet of Things
-5G Technology
-Artificial Intelligence
-Cloud Computing
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EP2A70F1020C9 FAQ Chips
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Q: How can I obtain software development tools related to the Altera FPGA platform?
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ICs EP2A70F1020C9 Features
■ Flash memory block/sector protection capability via external flash interface
■ External flash interface supports parallel programming of flash and external processor access to unused portions of memory
■ Contains 4-, 8-, and 16-Mbit flash memories for configuration data storage
This chapter describes the EPC4, EPC8, and EPC16 enhanced configuration devices (EPC).
■ On-chip decompression feature almost doubles the effective configuration density
■ Supported in EPC16 and EPC4 devices
■ Single-chip configuration solution for Altera ACEX 1K, APEX 20K (including APEX 20K, APEX 20KC, and APEX 20KE), APEX II, Arria GX, Cyclone, Cyclone II, FLEX 10K (including FLEX 10KE and FLEX 10KA), Mercury, Stratix II, and
Stratix II GX devices
■ Standard flash die and a controller die combined into single stacked chip package
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Xilinx EP2A70F1020C9 Overview
The Altera EP2A70F1020C9 enhanced configuration device is a single-device, high-speed, advanced configuration solution for very high-density FPGAs. The core of an enhanced configuration device is divided into two major blocks: a configuration controller and a flash memory. The flash memory is used to store configuration data for systems made up of one or more Altera EP2A70F1020C9 FPGAs. Unused portions of the flash memory can be used to store processor code or data that can be accessed via the external flash interface after FPGA configuration is complete.
EP2A70F1020C9 Tags integrated circuit
1. APEX II starter kit
2. EP2A70F1020C9 Datasheet PDF
3. EP2A70 reference design
4. Altera APEX II development board
5. EP2A70 development board
6. EP2A70 evaluation board
7. APEX II EP2A70
8. Altera EP2A70
9. Altera APEX II development board
Xilinx EP2A70F1020C9 TechnicalAttributes
-Supplier Device Package 1020-FBGA (33×33)
-Number of I/O 735
-Mounting Type Surface Mount
-Number of Gates 5250000
-Number of Logic Elements/Cells 67200
-Total RAM Bits 1146880
-Voltage – Supply 1.425V ~ 1.575V
-Number of LABs/CLBs 6720
-Package / Case 1020-BBGA
-Operating Temperature 0℃ ~ 85℃ (TJ)