EP2A70F1508C9N ApplicationField
-Medical Equipment
-Industrial Control
-Cloud Computing
-5G Technology
-Consumer Electronics
-Internet of Things
-Artificial Intelligence
-Wireless Technology
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ICs EP2A70F1508C9N Features
■ External flash interface supports parallel programming of flash and external processor access to unused portions of memory
This chapter describes the EPC4, EPC8, and EPC16 enhanced configuration devices (EPC).
■ On-chip decompression feature almost doubles the effective configuration density
■ Contains 4-, 8-, and 16-Mbit flash memories for configuration data storage
■ Standard flash die and a controller die combined into single stacked chip package
Stratix II GX devices
■ Single-chip configuration solution for Altera ACEX 1K, APEX 20K (including APEX 20K, APEX 20KC, and APEX 20KE), APEX II, Arria GX, Cyclone, Cyclone II, FLEX 10K (including FLEX 10KE and FLEX 10KA), Mercury, Stratix II, and
■ Flash memory block/sector protection capability via external flash interface
■ Supported in EPC16 and EPC4 devices
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Xilinx EP2A70F1508C9N Overview
The Altera EP2A70F1508C9N enhanced configuration device is a single-device, high-speed, advanced configuration solution for very high-density FPGAs. The core of an enhanced configuration device is divided into two major blocks: a configuration controller and a flash memory. The flash memory is used to store configuration data for systems made up of one or more Altera EP2A70F1508C9N FPGAs. Unused portions of the flash memory can be used to store processor code or data that can be accessed via the external flash interface after FPGA configuration is complete.
EP2A70F1508C9N Tags integrated circuit
1. EP2A70 evaluation board
2. APEX II EP2A70
3. APEX II starter kit
4. EP2A70F1508C9N Datasheet PDF
5. EP2A70 development board
6. Altera APEX II development board
7. EP2A70 reference design
8. APEX II evaluation kit
9. EP2A70F1508C9N Datasheet PDF
Xilinx EP2A70F1508C9N TechnicalAttributes
-Number of LABs/CLBs 6720
-Mounting Type Surface Mount
-Total RAM Bits 1146880
-Number of Logic Elements/Cells 67200
-Operating Temperature 0??C ~ 85??C (TJ)
-Voltage – Supply 1.425V ~ 1.575V
-Number of I/O 735
-Supplier Device Package 1020-FBGA (33×33)
-Package / Case 1020-BBGA
-Number of Gates 5250000