EP2C50F484C8N ApplicationField
-Artificial Intelligence
-Wireless Technology
-Medical Equipment
-Industrial Control
-Cloud Computing
-5G Technology
-Internet of Things
-Consumer Electronics
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ICs EP2C50F484C8N Features
The Cyclone II device family offers the following features:
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Xilinx EP2C50F484C8N Overview
Functional
Cyclonee I devices contain a two-dimensional row-and column-basedDescrintion arhitecture toimplement custom losic. Column androw interconnects of varying speeds provide signal interconnects between logic array blocks(LABs), embedded memory blocks, and embedded multipliers.
The logic array consists of LABs, with 16 logic elements(LEs) in each LAB. An LE is a small unit of logic providing efficient implementation of user logic functions. LABs are grouped into rows and columns across the device. Cyclone II devices range in density from 4,608 to 68,416LEs.
Cyclone II devices provide a global clock network and up to four phase-locked loops(PLLs). The global clock network consists of up to 16
global clock lines that drive throughout the entire device. The global clock network can provide clocks for all resources within the device, such as input/output elements(IOEs), LEs, embedded multipliers, and embedded memory blocks. The global clock lines can also be used forother high fan-out signals. Cyclone IⅡ PLLs provide general-purpose clocking with clock synthesis and phase shifting as well as external outputs for high-speed differential I/O support.
M4K memory blocks are true dual-port memory blocks with 4K bits of memory plus parity (4,608 bits). These blocks provide dedicated true dual-port, simple dual-port, or single-port memory up to 36-bits wide at up to 260 MHz. These blocks are arranged in columns across the device in between certain LABs. Cyclone II devices offer between 119 to1,152 Kbits of embedded memory.
Each embedded multiplier block can implement up to either two9×9-bit multipliers, or one 18× 18-bit multiplier with up to 250-MHz performance. Embedded multipliers are arranged in columns across the device.
Each Cyclone II device I/O pin is fed by an IOE located at the ends ofLAB rows and columns around the periphery of the device.I/O pins support various single-ended and differential I/O standards, such as the 66-and 33-MHz,64-and 32-bit PCI standard, PCI-X, and the LVDS I/O standard at a maximum data rate of 805 megabits per second(Mbps) for inputs and 640Mbps for outputs. Each IOE contains a bidirectional I/O buffer and three registers for registering input, output, and output-enable signals.
Dual-purpose DQS, DQ, and DM pins along with delay chains(used tophase-align double data rate(DDR) signals) provide interface support for external memory devices such as DDR, DDR2, and single data rate(SDR)
SDRAM, and QDRII SRAM devices at up to 167 MHz.
Figure 2-1 shows a diagram of the Cyclone lⅡ EP2C20 device.
The INTEL Programmable Logic ICs series EP2C50F484C8N is FPGA, CYCLONE II, 50K LE, 484FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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EP2C50F484C8N Tags integrated circuit
1. INTEL EP2C50
2. Cyclone II FPGA EP2C50
3. EP2C50 development board
4. EP2C50F484C8N Datasheet PDF
5. EP2C50 reference design
6. Cyclone II FPGA evaluation kit
7. Cyclone II FPGA starter kit
8. EP2C50 evaluation board
9. EP2C50F484C8N Datasheet PDF
Xilinx EP2C50F484C8N TechnicalAttributes
-Package / Case FBGA-484
-Number of Logic Blocks 3158
-Mounting Style SMD/SMT
-Series Cyclone II
-Maximum Operating Temperature + 70 C
-Operating Supply Voltage 1.15 V to 1.25 V
-Embedded Block RAM – EBR 594 kbit
-Minimum Operating Temperature 0 C
-Number of I/Os 294
-Packaging Tray
-Distributed RAM 594 kbit
