EP3C25E144I7N -Medical Equipment -Artificial Intelligence

EP3C25E144I7N ApplicationField

-5G Technology
-Internet of Things
-Cloud Computing
-Industrial Control
-Consumer Electronics
-Artificial Intelligence
-Wireless Technology
-Medical Equipment

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EP3C25E144I7N FAQ Chips 

Q: How to obtain EP3C25E144I7N technical support documents?
A: Enter the “EP3C25E144I7N” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: Where can I purchase INTEL EP3C25 Development Boards, Evaluation Boards, or Cyclone III FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: Does the price of EP3C25E144I7N devices fluctuate frequently?
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A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the EP3C25E144I7N pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.

Q: How can I obtain software development tools related to the INTEL FPGA platform?
A: Quartus Prime Modelsim is the corresponding programming software for FPGA produced by Altera/Intel. The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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ICs EP3C25E144I7N Features

Cyclone III LS devices offer the following design security features:

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Xilinx EP3C25E144I7N Overview

Cyclone III Device Family Features
Cyclone III device family offers the following features:
Lowest Power FPGAs
■ Lowest power consumption with TSMC low-power process technology and
Altera® power-aware design flow
■ Low-power operation offers the following benefits:
■ Extended battery life for portable and handheld applications
■ Reduced or eliminated cooling system costs
■ Operation in thermally-challenged environments
■ Hot-socketing operation support

Design Security Feature

Cyclone III LS devices offer the following design security features:
■ Configuration security using advanced encryption standard (AES) with 256-bit volatile key
■ Routing architecture optimized for design separation flow with the Quartus® II software
■ Design separation flow achieves both physical and functional isolation between design partitions
■ Ability to disable external JTAG port
■ Error Detection (ED) Cycle Indicator to core
■ Provides a pass or fail indicator at every ED cycle
■ Provides visibility over intentional or unintentional change of configuration random access memory (CRAM) bits
■ Ability to perform zeroization to clear contents of the FPGA logic, CRAM, embedded memory, and AES key

■ Internal oscillator enables system monitor and health check capabilities

Increased System Integration
■ High memory-to-logic and multiplier-to-logic ratio
■ High I/O count, low-and mid-range density devices for user I/O constrained applications
■ Adjustable I/O slew rates to improve signal integrity
■ Supports I/O standards such as LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, bus LVDS (BLVDS), LVDS, mini-LVDS, RSDS, and PPDS
■ Supports the multi-value on-chip termination (OCT) calibration feature to eliminate variations over process, voltage, and temperature (PVT)
■ Four phase-locked loops (PLLs) per device provide robust clock management and synthesis for device clock management, external system clock management, and I/O interfaces
■ Five outputs per PLL
■ Cascadable to save I/Os, ease PCB routing, and reduce jitter
■ Dynamically reconfigurable to change phase shift, frequency multiplication or division, or both, and input frequency in the system without reconfiguring the device
■ Remote system upgrade without the aid of an external controller
■ Dedicated cyclical redundancy code checker circuitry to detect single-event upset (SEU) issues
■ Nios® II embedded processor for Cyclone III device family, offering low cost and custom-fit embedded processing solutions

■ Wide collection of pre-built and verified IP cores from Altera and Altera Megafunction Partners Program (AMPP) partners
■ Supports high-speed external memory interfaces such as DDR, DDR2, SDR SDRAM, and QDRII SRAM
■ Auto-calibrating PHY feature eases the timing closure process and eliminates variations with PVT for DDR, DDR2, and QDRII SRAM interfaces

The INTEL Embedded – FPGAs (Field Programmable Gate Array) series EP3C25E144I7N is FPGA Cyclone III Family 24624 Cells 437.5MHz 65nm Technology 1.2V 144Pin EQFP EP, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

EP3C25E144I7N Tags integrated circuit

1. INTEL Cyclone III FPGAs development board
2. Cyclone III FPGAs evaluation kit
3. Cyclone III FPGAs EP3C25
4. EP3C25E144I7N Datasheet PDF
5. EP3C25 reference design
7. EP3C25 development board
8. EP3C25 evaluation board
9. EP3C25E144I7N Datasheet PDF

Xilinx EP3C25E144I7N TechnicalAttributes

-Series Cyclone III
-Mounting Style SMD/SMT
-Minimum Operating Temperature – 40℃
-Embedded Block RAM – EBR 608 kbit
-Operating Supply Voltage 1.15 V to 1.25 V
-Maximum Operating Temperature + 85℃
-Packaging Tray
-Distributed RAM 608 kbit
-Package / Case QFP-144
-Maximum Operating Frequency 315 MHz

-Number of Logic Blocks 1539

-Number of I/Os 82

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