EP3C25F324C8 -Cloud Computing -Wireless Technology

EP3C25F324C8 ApplicationField

-Artificial Intelligence
-5G Technology
-Medical Equipment
-Consumer Electronics
-Industrial Control
-Wireless Technology
-Internet of Things
-Cloud Computing

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EP3C25F324C8 FAQ Chips 

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A: No, only submit the quantity, email address and other contact information required for the inquiry of EP3C25F324C8, but you need to sign up for the post comments and resource downloads.

Q: Where can I purchase INTEL EP3C25 Development Boards, Evaluation Boards, or Cyclone III FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: Does the price of EP3C25F324C8 devices fluctuate frequently?
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Q: How to obtain EP3C25F324C8 technical support documents?
A: Enter the “EP3C25F324C8” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: How can I obtain software development tools related to the INTEL FPGA platform?
A: Quartus Prime Modelsim is the corresponding programming software for FPGA produced by Altera/Intel. The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: What should I do if I did not receive the technical support for EP3C25F324C8 in time?
A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the EP3C25F324C8 pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.

ICs EP3C25F324C8 Features

Cyclone III LS devices offer the following design security features:

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Xilinx EP3C25F324C8 Overview

Cyclone III EP3C25F324C8 device offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants:■ Cyclone III—lowest power, high functionality with the lowest cost■ Cyclone III LS—lowest power FPGAs with securityWith densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power consumption, Cyclone III EP3C25F324C8 makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application.Design Security Feature
The INTEL FPGA – Field Programmable Gate Array series EP3C25F324C8 is FPGA – Field Programmable Gate Array FPGA – Cyclone III 1539 LABs 215 IOs, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

EP3C25F324C8 Tags integrated circuit

1. EP3C25 development board
2. INTEL Cyclone III FPGAs development board
3. EP3C25 evaluation board
4. Cyclone III FPGAs evaluation kit
5. INTEL EP3C25
6. Cyclone III FPGAs EP3C25
7. Cyclone III FPGAs starter kit
8. EP3C25 reference design
9. Cyclone III FPGAs evaluation kit

Xilinx EP3C25F324C8 TechnicalAttributes

-Operating Supply Voltage 1.15 V to 1.25 V
-Package / Case FBGA-324
-Maximum Operating Frequency 315 MHz
-Embedded Block RAM – EBR 608 kbit
-Maximum Operating Temperature + 70 C
-Minimum Operating Temperature 0 C
-Number of Logic Blocks 1539
-Packaging Tray
-Series Cyclone III
-Distributed RAM 608 kbit

-Mounting Style SMD/SMT

-Number of I/Os 215

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