EP3SE80F780C4N ApplicationField
-Industrial Control
-Artificial Intelligence
-Medical Equipment
-5G Technology
-Cloud Computing
-Internet of Things
-Wireless Technology
-Consumer Electronics
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EP3SE80F780C4N FAQ Chips
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Q: Where can I purchase INTEL EP3SE80 Development Boards, Evaluation Boards, or Stratix III Enhanced FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
ICs EP3SE80F780C4N Features
Stratix III devices offer the following features:
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Xilinx EP3SE80F780C4N Overview
Features Summary
Stratix III devices offer the following features:
■ 48,000 to 338,000 equivalent logic elements (LEs) ( refer to Table 1–1)
■ 2,430 to 20,497 Kbits of enhanced TriMatrix memory consisting of three RAM block sizes to implement true dual-port memory and FIFO buffers
■ High-speed DSP blocks provide dedicated implementation of 9×9, 12×12, 18×18, and 36×36 multipliers (at up to 550 MHz), multiply-accumulate functions, and finite impulse response (FIR) filters
■ I/O:GND:PWR ratio of 8:1:1 along with on-die and on-package decoupling for robust signal integrity
■ Programmable Power Technology, which minimizes power while maximizing device performance
■ Selectable Core Voltage, available in low-voltage devices (L ordering code suffix), enables selection of lowest power or highest performance operation
■ Up to 16 global clocks, 88 regional clocks, and 116 peripheral clocks per device
■ Up to 12 phase-locked loops (PLLs) per device that support PLL reconfiguration, clock switchover, programmable bandwidth, clock synthesis, and dynamic phase shifting
■ Memory interface support with dedicated DQS logic on all I/O banks
■ Support for high-speed external memory interfaces including DDR, DDR2, DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modular I/O banks
■ Up to 1,104 user I/O pins arranged in 24 modular I/O banks that support a wide range of industry I/O standards
■ Dynamic On-Chip Termination (OCT) with auto calibration support on all I/O banks
■ High-speed differential I/O support with serializer/deserializer (SERDES) and dynamic phase alignment (DPA) circuitry for 1.6 Gbps performance
■ Support for high-speed networking and communications bus standards including SPI-4.2, SFI-4, SGMII, Utopia IV, 10 Gigabit Ethernet XSBI, Rapid I/O, and NPSI
■ The only high-density, high-performance FPGA with support for 256-bit AES volatile and non-volatile security key to protect designs
■ Robust on-chip hot socketing and power sequencing support
■ Integrated cyclical redundancy check (CRC) for configuration memory error detection with critical error determination for high availability systems support
■ Built-in error correction coding (ECC) circuitry to detect and correct data errors in M144K TriMatrix memory blocks
■ Nios® II embedded processor support
■ Support for multiple intellectual property megafunctions from Altera® MegaCore® functions and Altera Megafunction Partners Program (AMPPSM)
The INTEL Programmable Logic ICs series EP3SE80F780C4N is FPGA Stratix III E Family 80000 Cells 450MHz 65nm Technology 1.1V 780-Pin FC-FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
EP3SE80F780C4N Tags integrated circuit
1. Stratix III Enhanced evaluation kit
2. EP3SE80 reference design
3. EP3SE80 development board
4. Stratix III Enhanced EP3SE80
5. EP3SE80F780C4N Datasheet PDF
6. EP3SE80 evaluation board
7. Stratix III Enhanced starter kit
8. INTEL Stratix III Enhanced development board
9. Stratix III Enhanced EP3SE80
Xilinx EP3SE80F780C4N TechnicalAttributes
-Embedded Block RAM – EBR 6.1 Mbit
-Operating Supply Voltage 1.2 V to 3.3 V
-Package / Case FBGA-780
-Packaging Tray
-Maximum Operating Temperature + 70 C
-Minimum Operating Temperature 0 C
-Number of Logic Blocks 3200
-Number of I/Os 488
-Mounting Style SMD/SMT
-Series Stratix III
-Distributed RAM 6.6 Mbit
