EPF10K30AQC240-1N ApplicationField
-Cloud Computing
-Industrial Control
-Consumer Electronics
-Medical Equipment
-Internet of Things
-Wireless Technology
-Artificial Intelligence
-5G Technology
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EPF10K30AQC240-1N FAQ Chips
Q: Where can I purchase INTEL EPF10K30A Development Boards, Evaluation Boards, or FLEX 10K Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
Q: How can I obtain software development tools related to the INTEL FPGA platform?
A: Quartus Prime Modelsim is the corresponding programming software for FPGA produced by Altera/Intel. The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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ICs EPF10K30AQC240-1N Features
■ The industry's first embedded programmable logic device (PLD) family,
providing System-on-a-Programmable-Chip (SOPC) integration
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Xilinx EPF10K30AQC240-1N Overview
Description
Each FLEX 10K device contains an embedded array to implement
memory and specialized logic functions, and a logic array to implement
general logic.
The embedded array consists of a series of EABs. When implementing
memory functions, each EAB provides 2,048 bits, which can be used to
create RAM, ROM, dual-port RAM, or first-in first-out (FIFO) functions.
When implementing logic, each EAB can contribute 100 to 600 gates
towards complex logic functions, such as multipliers, microcontrollers,
state machines, and DSP functions. EABs can be used independently, or
multiple EABs can be combined to implement larger functions.
Features
■ The industry’s first embedded programmable logic device (PLD) family, providing System-on-a-Programmable-Chip (SOPC) integration
– Embedded array for implementing megafunctions, such as efficient memory and specialized logic functions
– Logic array for general logic functions
■ High density
– 10,000 to 250,000 typical gates (see Tables 1 and 2)
– Up to 40,960 RAM bits; 2,048 bits per embedded array block (EAB), all of which can be used without reducing logic capacity
■ System-level features
– MultiVoltTM I/O interface support
– 5.0-V tolerant input pins in FLEX® 10KA devices
– Low power consumption (typical specification less than 0.5 mA in standby mode for most devices)
– FLEX 10K and FLEX 10KA devices support peripheral component interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2
– FLEX 10KA devices include pull-up clamping diode, selectable on a pin-by-pin basis for 3.3-V PCI compliance
– Select FLEX 10KA devices support 5.0-V PCI buses with eight or fewer loads
– Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming any device logic
The INTEL Embedded – FPGAs (Field Programmable Gate Array) series EPF10K30AQC240-1N is FPGA – Field Programmable Gate Array FPGA – Flex 10K 216 LABs 189 IOs, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
EPF10K30AQC240-1N Tags integrated circuit
1. EPF10K30A development board
2. INTEL FLEX 10K development board
3. FLEX 10K EPF10K30A
4. EPF10K30A evaluation board
5. EPF10K30AQC240-1N Datasheet PDF
6. FLEX 10K evaluation kit
7. FLEX 10K starter kit
8. INTEL EPF10K30A
9. EPF10K30A evaluation board
Xilinx EPF10K30AQC240-1N TechnicalAttributes
-Series FLEX 10K
-Maximum Operating Temperature + 70 C
-Minimum Operating Temperature 0 C
-Distributed RAM 12.2 kbit
-Operating Supply Current 10 mA
-Number of Logic Blocks 216
-Mounting Style SMD/SMT
-Number of I/Os 189
-Package / Case QFP-240
-Packaging Tray
-Operating Supply Voltage 3.3 V