EPF6024AFI256-2 -Consumer Electronics -Wireless Technology

EPF6024AFI256-2 ApplicationField

-5G Technology
-Cloud Computing
-Internet of Things
-Industrial Control
-Artificial Intelligence
-Wireless Technology
-Medical Equipment
-Consumer Electronics

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EPF6024AFI256-2 FAQ Chips 

Q: Does the price of EPF6024AFI256-2 devices fluctuate frequently?
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Q: How to obtain EPF6024AFI256-2 technical support documents?
A: Enter the “EPF6024AFI256-2” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: How can I obtain software development tools related to the INTEL FPGA platform?
A: Quartus Prime Modelsim is the corresponding programming software for FPGA produced by Altera/Intel. The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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Q: Where can I purchase INTEL EPF6024A Development Boards, Evaluation Boards, or FLEX 6000 PLD Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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ICs EPF6024AFI256-2 Features

– MultiVoltTM I/O interface operation, allowing a device to bridge
■ System-level features
– Built-in Joint Test Action Group (JTAG) boundary-scan test
– Built-in low-skew clock distribution tree
Specification, Revision 2.2
– Typical gates ranging from 5,000 to 24,000 gates (see Table 1)
■ Product features
– In-circuit reconfigurability (ICR) via external configuration
– OptiFLEX architecture that increases device area efficiency
between systems operating at different voltages
■ Provides an ideal low-cost, programmable alternative to highvolume gate array applications and allows fast design changes
in standby mode)
– 3.3-V devices support hot-socketing
during prototyping or design testing
without consuming additional device logic
– Low power consumption (typical specification less than 0.5 mA
– Register-rich, look-up table- (LUT-) based architecture
(BST) circuitry compliant with IEEE Std. 1149.1-1990, available
are not required
interconnect Special Interest Group (PCI SIG) PCI Local Bus
device or intelligent controller
– 100% functional testing of all devices; test vectors or scan chains
– 5.0-V devices are fully compliant with peripheral component

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Xilinx EPF6024AFI256-2 Overview

The Altera FLEX 6000 EPF6024AFI256-2 programmable logic device (PLD) provides a low-cost alternative to high-volume gate array designs. FLEX 6000 devices are based on the OptiFLEX architecture, which minimizes die size while maintaining high performance and routability. The devices have reconfigurable SRAM elements, which give designers the flexibility to quickly change their designs during prototyping and design testing. Designers can also change functionality during operation via in-circuit reconfiguration.FLEX 6000 EPF6024AFI256-2 devices are reprogrammable, and they are 100% tested prior to shipment. As a result, designers are not required to generate test vectors for fault coverage purposes, allowing them to focus on simulation and design verification. In addition, the designer does not need to manage inventories of different gate array designs. FLEX EPF6024AFI256-2 devices are configured on the board for the specific functionality required.
The INTEL FPGAs series EPF6024AFI256-2 is FPGA FLEX 6000 Family 24K Gates 1960 Cells 166.67MHz 0.42um Technology 3.3V 256Pin FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

EPF6024AFI256-2 Tags integrated circuit

1. FLEX 6000 Devices starter kit
2. EPF6024AFI256-2 Datasheet PDF
3. FLEX 6000 Devices EPF6024A
4. EPF6024A development board
5. EPF6024A evaluation board
6. INTEL FLEX 6000 Devices development board
7. EPF6024A reference design
8. INTEL EPF6024A
9. EPF6024A development board

Xilinx EPF6024AFI256-2 TechnicalAttributes

-Number of LABs/CLBs 196
-Number of Gates 24000
-Package / Case 256-BGA
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Mounting Type Surface Mount
-Number of Logic Elements/Cells 1960
-Number of I/O 219

-Voltage – Supply 3V ~ 3.6V
-Supplier Device Package 256-FBGA (17×17)

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