EPF81188ARC240-3 ApplicationField
-Wireless Technology
-Medical Equipment
-Internet of Things
-Industrial Control
-Consumer Electronics
-Cloud Computing
-Artificial Intelligence
-5G Technology
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EPF81188ARC240-3 FAQ Chips
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ICs EPF81188ARC240-3 Features
– Tri-state emulation that implements internal tri-state nets
– FastTrack Interconnect continuous routing structure for fast, predictable interconnect delays
– Dedicated carry chain that implements arithmetic functions such as fast adders, counters, and comparators (automatically used by software tools and megafunctions)
– Fully compliant with the peripheral component interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 for 5.0-V operation
■ Low-cost, high-density, register-rich CMOS programmable logic device (PLD) family (see Table 1)
– Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990 on selected devices
– 282 to 1,500 registers
■ System-level features
– 2,500 to 16,000 usable gates
– MultiVoltTM I/O interface enabling device core to run at 5.0 V, while I/O pins are compatible with 5.0-V and 3.3-V logic levels
■ Programmable output slew-rate control reduces switching noise
■ Powerful I/O pins
■ Flexible interconnect
– Dedicated cascade chain that implements high-speed, high-fan-in logic functions (automatically used by software tools and megafunctions)
– In-circuit reconfigurability (ICR) via external configuration devices or intelligent controller
– Low power consumption (typical specification is 0.5 mA or less in standby mode)
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Xilinx EPF81188ARC240-3 Overview
Altera’s Flexible Logic Element MatriX (FLEX) EPF81188ARC240-3 combines the benefits of both erasable programmable logic devices (EPLDs) and fieldprogrammable gate arrays (FPGAs). The FLEX 8000 EPF81188ARC240-3 device s ideal for a variety of applications because it combines the fine-grained architecture and high register count characteristics of FPGAs with the high speed and predictable interconnect delays of EPLDs. Logic is implemented in LEs that include compact 4-input look-up tables (LUTs) and programmable registers. High performance is provided by a fast, continuous network of routing resources.FLEX 8000 EPF81188ARC240-3 devices provide a large number of storage elements for applications such as digital signal processing (DSP), wide-data-path manipulation, and data transformation. These devices are an excellent choice for bus interfaces, TTL integration, coprocessor functions, and high-speed controllers. The high-pin-count packages can integrate multiple 32-bit buses into a single device.The logic and interconnections in the FLEX 8000 architecture are configured with CMOS SRAM elements. FLEX 8000 EPF81188ARC240-3 devices are configured at system power-up with data stored in an industry-standard parallel EPROM or an Altera serial configuration devices, or with data provided by a system controller. Altera offers the EPC1, EPC1213, EPC1064, and EPC1441 configuration devices, which configure FLEX EPF81188ARC240-3 devices via a serial data stream. Configuration data can also be stored in an industry-standard 32 K × 8 bit or larger configuration device, or downloaded from system RAM.
The INTEL Ceramic Capacitors series EPF81188ARC240-3 is Multilayer Ceramic Capacitor, 0.1µF, 50V, MC Series, ± 10%, Radial Leaded, X7R, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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EPF81188ARC240-3 Tags integrated circuit
1. FLEX 8000 Devices evaluation kit
2. INTEL FLEX 8000 Devices development board
3. EPF81188A reference design
4. EPF81188ARC240-3 Datasheet PDF
5. EPF81188A evaluation board
6. EPF81188A development board
7. INTEL EPF81188A
8. FLEX 8000 Devices EPF81188A
9. EPF81188ARC240-3 Datasheet PDF
Xilinx EPF81188ARC240-3 TechnicalAttributes
-Voltage – Supply 4.75V ~ 5.25V
-Operating Temperature 0℃ ~ 70℃ (TA)
-Number of LABs/CLBs 126
-Number of Logic Elements/Cells 1008
-Mounting Type Surface Mount
-Number of Gates 12000
-Package / Case 240-BFQFP Exposed Pad
-Number of I/O 184
-Supplier Device Package 240-RQFP (32×32)