EPM570T100C3N -Internet of Things -5G Technology

EPM570T100C3N ApplicationField

-Industrial Control
-Wireless Technology
-Medical Equipment
-Consumer Electronics
-Artificial Intelligence
-5G Technology
-Cloud Computing
-Internet of Things

Request EPM570T100C3N FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now

EPM570T100C3N FAQ Chips 

Q: Does the price of EPM570T100C3N devices fluctuate frequently?
A: The RAYPCB search engine monitors the EPM570T100C3N inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.

Q: How can I obtain software development tools related to the INTEL FPGA platform?
A: Quartus Prime Modelsim is the corresponding programming software for FPGA produced by Altera/Intel. The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: How to obtain EPM570T100C3N technical support documents?
A: Enter the “EPM570T100C3N” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: Where can I purchase INTEL EPM570 Development Boards, Evaluation Boards, or MAX II CPLDS Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: What should I do if I did not receive the technical support for EPM570T100C3N in time?
A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the EPM570T100C3N pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.

Q: Do I have to sign up on the website to make an inquiry for EPM570T100C3N?
A: No, only submit the quantity, email address and other contact information required for the inquiry of EPM570T100C3N, but you need to sign up for the post comments and resource downloads.

ICs EPM570T100C3N Features

Request EPM570T100C3N FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now

Xilinx EPM570T100C3N Overview


The MAX® II family of instant-on, non-volatile CPLDs is based on a 0.18-µm,
6-layer-metal-flash process, with densities from 240 to 2,210 logic elements (LEs) (128
to 2,210 equivalent macrocells) and non-volatile storage of 8 Kbits. MAX II devices
offer high I/O counts, fast performance, and reliable fitting versus other CPLD
architectures. Featuring MultiVolt core, a user flash memory (UFM) block, and
enhanced in-system programmability (ISP), MAX II devices are designed to reduce
cost and power while providing programmable solutions for applications such as bus
bridging, I/O expansion, power-on reset (POR) and sequencing control, and device
configuration control.


The MAX II CPLD has the following features: 

■ Low-cost, low-power CPLD 

■ Instant-on, non-volatile architecture 

■ Standby current as low as 25 µA 

■ Provides fast propagation delay and clock-to-output times 

■ Provides four global clocks with two clocks available per logic array block (LAB) 

■ UFM block up to 8 Kbits for non-volatile storage 

■ MultiVolt core enabling external supply voltages to the device of either
3.3 V/2.5 V or 1.8 V 

■ MultiVolt I/O interface supporting 3.3-V, 2.5-V, 1.8-V, and 1.5-V logic levels 

■ Bus-friendly architecture including programmable slew rate, drive strength,
bus-hold, and programmable pull-up resistors 

■ Schmitt triggers enabling noise tolerant inputs (programmable per pin) 

■ I/Os are fully compliant with the Peripheral Component Interconnect Special
Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 for 3.3-V
operation at 66 MHz 

■ Supports hot-socketing 

■ Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry
compliant with IEEE Std. 1149.1-1990 

■ ISP circuitry compliant with IEEE Std. 1532

Functional Description

MAX® II devices contain a two-dimensional row- and column-based architecture to
implement custom logic. Row and column interconnects provide signal interconnects
between the logic array blocks (LABs).

The logic array consists of LABs, with 10 logic elements (LEs) in each LAB. An LE is a
small unit of logic providing efficient implementation of user logic functions. LABs
are grouped into rows and columns across the device. The MultiTrack interconnect
provides fast granular timing delays between LABs. The fast routing between LEs
provides minimum timing delay for added levels of logic versus globally routed
interconnect structures.

The MAX II device I/O pins are fed by I/O elements (IOE) located at the ends of LAB
rows and columns around the periphery of the device. Each IOE contains a
bidirectional I/O buffer with several advanced features. I/O pins support Schmitt
trigger inputs and various single-ended standards, such as 66-MHz, 32-bit PCI, and

MAX II devices provide a global clock network. The global clock network consists of
four global clock lines that drive throughout the entire device, providing clocks for all
resources within the device. The global clock lines can also be used for control signals
such as clear, preset, or output enable.

The INTEL Embedded – CPLDs (Complex Programmable Logic Devices) series EPM570T100C3N is CPLD MAX II Family 440 Macro Cells 304MHz 0.18um Technology 2.5V/3.3V 100Pin TQFP, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

EPM570T100C3N Tags integrated circuit

1. EPM570 development board
2. EPM570 evaluation board
4. MAX II CPLDS evaluation kit
5. INTEL MAX II CPLDS development board
6. EPM570T100C3N Datasheet PDF
8. EPM570 reference design
9. MAX II CPLDS evaluation kit

Xilinx EPM570T100C3N TechnicalAttributes

-Maximum Operating Frequency 304 MHz
-Supply Voltage – Max 3.6 V
-Packaging Tray
-Package / Case TQFP-100
-Operating Supply Voltage 2.5 V, 3.3 V
-Mounting Style SMD/SMT
-Number of Programmable I/Os 76
-Delay Time 5.4 ns
-Number of Macrocells 440
-Supply Voltage – Min 2.375 V
-Memory Type Flash
-Series MAX II

-Supply Current 55 mA

-Minimum Operating Temperature 0 C
-Maximum Operating Temperature + 70 C

    GET A FREE QUOTE PCB Manufacturing & Assembly Service
    File Upload