LC4256V75FTN256B-10I ApplicationField
-Wireless Technology
-Medical Equipment
-5G Technology
-Artificial Intelligence
-Internet of Things
-Industrial Control
-Cloud Computing
-Consumer Electronics
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LC4256V75FTN256B-10I FAQ Chips
Q: How to obtain LC4256V75FTN256B-10I technical support documents?
A: Enter the “LC4256V75FTN256B-10I” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
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A: No, only submit the quantity, email address and other contact information required for the inquiry of LC4256V75FTN256B-10I, but you need to sign up for the post comments and resource downloads.
Q: Where can I purchase Lattice LC4256 Development Boards, Evaluation Boards, or ispMACH 4000V/B/C/Z Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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ICs LC4256V75FTN256B-10I Features
■ High Performance
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Xilinx LC4256V75FTN256B-10I Overview
The high performance LC4256V75FTN256B-10I device from Lattice offers a SuperFAST CPLD solution. The family is a blend of Lattice’s two most popular architectures: the ispLSI 2000 and ispMACH 4A. Retaining the best of both families, the LC4256V75FTN256B-10I architecture focuses on significant innovations to combine the highest performance with low power in a flexible CPLD family. The LC4256V75FTN256B-10I combines high speed and low power with the flexibility needed for ease of design. With its robust Global Routing Pool and Output Routing Pool, this family delivers excellent First-Time-Fit, timing predictability, routing, pin-out retention and density migration. The LC4256V75FTN256B-10I device offers densities ranging from 32 to 512 macrocells. There are multiple density-I/O combinations in Thin Quad Flat Pack (TQFP), Chip Scale BGA (csBGA) and Fine Pitch Thin BGA (ftBGA) packages ranging from 44 to 256 pins/balls. Table 1 shows the macrocell, package and I/O options, along with other key parameters. The LC4256V75FTN256B-10I device has enhanced system integration capabilities. It supports 3.3V (4000V), 2.5V (4000B) and 1.8V (4000C/Z) supply voltages and 3.3V, 2.5V and 1.8V interface voltages. Additionally, inputs can be safely driven up to 5.5V when an I/O bank is configured for 3.3V operation, making this family 5V tolerant. The LC4256V75FTN256B-10I also offers enhanced I/O features such as slew rate control, PCI compatibility, bus-keeper latches, pull-up resistors, pull-down resistors, open drain outputs and hot socketing. The LC4256V75FTN256B-10I device members are 3.3V/ 2.5V/1.8V in-system programmable through the IEEE Standard 1532 interface. IEEE Standard 1149.1 boundary scan testing capability also allows product testing on automated test equipment. The 1532 interface signals TCK, TMS, TDI and TDO are referenced to VCC (logic core).
LC4256V75FTN256B-10I Tags integrated circuit
1. LC4256V75FTN256B-10I Datasheet PDF
2. Lattice LC4256
3. LC4256 development board
4. Lattice ispMACH 4000V/B/C/Z development board
5. ispMACH 4000V/B/C/Z LC4256
6. ispMACH 4000V/B/C/Z starter kit
7. ispMACH 4000V/B/C/Z evaluation kit
8. LC4256 reference design
9. Lattice ispMACH 4000V/B/C/Z development board
Xilinx LC4256V75FTN256B-10I TechnicalAttributes