LFE2M50E-6FN672C -Cloud Computing -5G Technology

LFE2M50E-6FN672C ApplicationField

-Consumer Electronics
-Wireless Technology
-Artificial Intelligence
-Medical Equipment
-Internet of Things
-5G Technology
-Industrial Control
-Cloud Computing

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LFE2M50E-6FN672C FAQ Chips 

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A: Enter the “LFE2M50E-6FN672C” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: Where can I purchase Lattice LFE2M50 Development Boards, Evaluation Boards, or LatticeECP2/M Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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Q: How can I obtain software development tools related to the Lattice FPGA platform?
A: Lattice’s development environment uses Diamone. These recommendations are all reference opinions. The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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ICs LFE2M50E-6FN672C Features

■ High Logic Density for System Integration

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Xilinx LFE2M50E-6FN672C Overview

The LatticeECP2/M family of FPGA devices is optimized to deliver high performance features such as advanced DSP blocks, high speed SERDES (LatticeECP2M family only) and high speed source synchronous interfaces in an economical FPGA fabric. This combination was achieved through advances in device architecture and the use of 90nm technology. The LatticeECP2/M FPGA fabric is optimized with high performance and low cost in mind. The LatticeECP2/M devices include LUT-based logic, distributed and embedded memory, Phase Locked Loops (PLLs), Delay Locked Loops (DLLs), pre-engineered source synchronous I/O support, enhanced sysDSP blocks and advanced configuration support, including encryption (���S��� versions only) and dual boot capabilities. The LatticeECP2M device family features high speed SERDES with PCS. These high jitter tolerance and low transmission jitter SERDES with PCS blocks can be configured to support an array of popular data protocols including PCI Express, Ethernet (1GbE and SGMII), OBSAI and CPRI. Transmit Pre-emphasis and Receive Equalization settings make SERDES suitable for chip to chip and small form factor backplane applications. Lattice Diamond庐 design software allows large complex designs to be efficiently implemented using the LatticeECP2/M FPGA family. Synthesis library support for LatticeECP2/M is available for popular logic synthesis tools. The Diamond software uses the synthesis tool output along with the constraints from its floor planning tools to place and route the design in the LatticeECP2/M device. The Diamond design tool extracts the timing from the routing and back-annotates it into the design for timing verification. Lattice provides many pre-engineered IP (Intellectual Property) modules for the LatticeECP2/M family. By using these IP cores as standardized blocks, designers are free to concentrate on the unique aspects of their design, increasing their productivity.

The Lattice FPGA – Field Programmable Gate Array series LFE2M50E-6FN672C is FPGA – Field Programmable Gate Array 48K LUTs 372 I/O Memory DSP 1.2V 6SPD, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

LFE2M50E-6FN672C Tags integrated circuit

1. LatticeECP2/M LFE2M50
2. LFE2M50 development board
3. LFE2M50E-6FN672C Datasheet PDF
4. LatticeECP2/M starter kit
5. LFE2M50 evaluation board
6. LatticeECP2/M evaluation kit
7. Lattice LFE2M50
8. LFE2M50 reference design
9. LatticeECP2/M starter kit

Xilinx LFE2M50E-6FN672C TechnicalAttributes

-Operating Supply Voltage 1.2 V
-Minimum Operating Temperature 0 C
-Maximum Operating Frequency 357 MHz
-Factory Pack Quantity 200
-Number of I/Os 372
-Package / Case FPBGA-672
-Packaging Tray

-Maximum Operating Temperature + 85℃
-Mounting Style SMD/SMT

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