LFE5UM-85F-6BG554C ApplicationField
-Internet of Things
-Cloud Computing
-Artificial Intelligence
-Industrial Control
-Consumer Electronics
-Wireless Technology
-Medical Equipment
-5G Technology
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ICs LFE5UM-85F-6BG554C Features
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Xilinx LFE5UM-85F-6BG554C Overview
The ECP5/ECP5-5G family of FPGA devices is optimized to deliver high performance features such as an enhanced DSP architecture, high speed SERDES (Serializer/Deserializer), and high speed source synchronous interfaces, in an economical FPGA fabric. This combination is achieved through advances in device architecture and the use of 40 nm technology making the devices suitable for high-volume, highspeed, and low-cost applications.
The ECP5/ECP5-5G device family covers look-up-table (LUT) capacity to 84K logic elements and supports up to 365 user I/O. The ECP5/ECP5-5G device family also offers up to 156 18 x 18 multipliers and a wide range of parallel I/O standards. The ECP5/ECP5-5G FPGA fabric is optimized high performance with low power and low cost in mind. The ECP5/ ECP5-5G devices utilize reconfigurable SRAM logic technology and provide popular building blocks such as LUT-based logic, distributed and embedded memory, Phase-Locked Loops (PLLs), Delay-Locked Loops (DLLs), pre-engineered source synchronous I/O support, enhanced sysDSP slices and advanced configuration support, including encryption and dual-boot capabilities.
The pre-engineered source synchronous logic implemented in the ECP5/ECP5-5G device family supports a broad range of interface standards including DDR2/3, LPDDR2/3, XGMII, and 7:1 LVDS. The ECP5/ECP5-5G device family also features high speed SERDES with dedicated Physical Coding Sublayer (PCS) functions. High jitter tolerance and low transmit jitter allow the SERDES plus PCS blocks to be configured to support an array of popular data protocols including PCI Express, Ethernet (XAUI, GbE, and SGMII) and CPRI. Transmit De-emphasis with pre- and post-cursors, and Receive Equalization settings make the SERDES suitable for transmission and reception over various forms of media.
The ECP5/ECP5-5G devices also provide flexible, reliable and secure configuration options, such as dual-boot capability, bit-stream encryption, and TransFR field upgrade features. ECP5-5G family devices have made some enhancement in the SERDES compared to ECP5UM devices. These enhancements increase the performance of the SERDES to up to 5 Gb/s data rate.
The ECP5-5G family devices are pin-to-pin compatible with the ECP5UM devices. These allows a migration path for you to port designs from ECP5UM to ECP5-5G devices to get higher performance.
The Lattice Diamond design software allows large complex designs to be efficiently implemented using the ECP5/ECP5-5G FPGA family. Synthesis library support for ECP5/ECP5-5G devices is available for popular logic synthesis tools. The Diamond tools use the synthesis tool output along with the constraints from its floor planning tools to place and route the design in the ECP5/ECP5-5G device. The tools extract the timing from the routing and back-annotate it into the design for timing verification.
Lattice provides many pre-engineered IP (Intellectual Property) modules for the ECP5/ECP5-5G family. By using these configurable soft core IPs as standardized blocks, designers are free to concentrate on the unique aspects of their design, increasing their productivity.
The Lattice Embedded – FPGAs (Field Programmable Gate Array) series LFE5UM-85F-6BG554C is ECP5 Series 84K LUTs 259 I/O 1.1V Slow Surface Mount FPGA – CABGA-554, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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LFE5UM-85F-6BG554C Tags integrated circuit
1. ECP5 evaluation kit
2. ECP5 starter kit
3. ECP5 LFE5UM-85
4. Lattice LFE5UM-85
5. LFE5UM-85F-6BG554C Datasheet PDF
6. Lattice ECP5 development board
7. LFE5UM-85 evaluation board
8. LFE5UM-85 development board
9. Lattice LFE5UM-85
Xilinx LFE5UM-85F-6BG554C TechnicalAttributes
-Mounting Type Surface Mount
-Voltage – Supply 1.045V ~ 1.155V
-Number of I/O 259
-Package / Case 554-FBGA
-Number of Logic Elements/Cells 84000
-Total RAM Bits 3833856
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Supplier Device Package 554-CABGA (23×23)
-Number of LABs/CLBs 21000