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LFX200EC-03FN256I FAQ Chips
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A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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ICs LFX200EC-03FN256I Features
■ Non-volatile, Infinitely Reconfigurable
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Xilinx LFX200EC-03FN256I Overview
The ispXPGA family of devices provides the ideal vehicle for the creation of
high-performance logic designs that are both non-volatile and infinitely
re-programmable. Other FPGA solutions force a compromise, being either
reprogrammable or non-volatile. This family couples this capability with a
mainstream architecture containing the features required for today’s
The ispXPGA family is available in two options. The
standard device supports sysHSI capability for ultra fast serial communications
while the lower-cost “E-Series” supports the same high-performance FPGA fabric
without the sysHSI Block.
Electrically Erasable CMOS (E2 CMOS) memory cells
provide the ispXPGA family with non-volatile capability. These allow logic to be
functional microseconds after power is applied, allowing easy interfacing in
many applications. This capability also means that expensive external
configuration memories are not required and that designs can be secured from
unauthorized read back. Internal SRAM cells allow the device to be infinitely
reconfigured if desired. Both the SRAM and E2 CMOS cells can be programmed and
verified through the IEEE 1532 industry standard. Additionally, the SRAM cells
can be configured and read-back through the sysCONFIG peripheral port.
family spans the density and I/O range required for the majority of today’s
logic designs, 139K to 1.25M system gates and 160 to 496 I/O. The devices are
available for operation from 1.8V, 2.5V, and 3.3V power supplies, providing easy
integration into the overall system.
System-level design needs are met through
the incorporation of sysMEM dual-port memory blocks, sysIO advanced I/O support,
and sysCLOCK Phase Locked Loops (PLLs). High-speed serial communications are
supported through multiple sysHSI blocks, which provide clock data recovery
(CDR) and serialization/de-serialization (SERDES).
The ispLEVER design tool
from Lattice allows easy implementation of designs using the ispXPGA product.
Synthesis library support is available for major logic synthesis tools. The
ispLEVER tool takes the output from these common synthesis packages and place
and routes the design in the ispXPGA product. The tool supports floor planning
and the management of other constraints within the device. The tool also
provides outputs to common timing analysis tools for timing analysis.
increase designer productivity, Lattice provides a variety of pre-designed
modules referred to as IP cores for the ispXPGA product. These IP cores allow
designers to concentrate on the unique portions of their design while using
pre-designed blocks to implement standard functions such as bus interfaces,
standard communication interfaces, and memory controllers.
Through the use of
advanced technology and innovative architecture the ispXPGA FPGA devices provide
designers with excellent speed performance. Although design dependent, many
typical designs can run at over 150MHz. Certain designs can run at over 300MHz.
Table 2 details the performance of several building blocks commonly used by
The Lattice Programmable Logic ICs series LFX200EC-03FN256I is FPGA – Field Programmable Gate Array E-Ser210K Gt ispJTAG 1.8V -3 Spd I, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
LFX200EC-03FN256I Tags integrated circuit
1. ispXPGA evaluation kit
2. Lattice ispXPGA development board
3. LFX200 evaluation board
4. ispXPGA starter kit
5. LFX200EC-03FN256I Datasheet PDF
6. LFX200 reference design
7. Lattice LFX200
8. LFX200 development board
9. ispXPGA starter kit
Xilinx LFX200EC-03FN256I TechnicalAttributes
-Mounting Style SMD/SMT
-Number of I/Os 160
-Minimum Operating Temperature – 40℃
-Maximum Operating Temperature + 105 C
-Operating Supply Voltage 1.8 V
-Factory Pack Quantity 450
-Number of Gates 210 K
-Package / Case FPBGA-256