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M1A3P1000L-FGG256I FAQ Chips
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ICs M1A3P1000L-FGG256I Features
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Xilinx M1A3P1000L-FGG256I Overview
Reduced Cost of Ownership
Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike SRAMbased FPGAs, flash-based ProASIC3E devices allow all functionality to be Instant On; no external boot
PROM is required. On-board security mechanisms prevent access to all the programming information
and enable secure remote updates of the FPGA logic. Designers can perform secure remote in-system
reprogramming to support future design iterations and field upgrades with confidence that valuable
intellectual property (IP) cannot be compromised or copied. Secure ISP can be performed using the
industry-standard AES algorithm. The ProASIC3E family device architecture mitigates the need for ASIC
migration at higher user volumes. This makes the ProASIC3E family a cost-effective ASIC replacement
solution, especially for applications in the consumer, networking/ communications, computing, and
The nonvolatile, flash-based ProASIC3E devices do not require a boot PROM, so there is no vulnerable
external bitstream that can be easily copied. ProASIC3E devices incorporate FlashLock, which provides
a unique combination of reprogrammability and design security without external overhead, advantages
that only an FPGA with nonvolatile flash programming can offer.
The Microsemi Embedded – FPGAs (Field Programmable Gate Array) series M1A3P1000L-FGG256I is IC FPGA 177 I/O 256FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
M1A3P1000L-FGG256I Tags integrated circuit
1. Microsemi M1A3P1000
2. Cortex-M1 Flash FPGAs M1A3P1000
3. Cortex-M1 Flash FPGAs starter kit
4. Microsemi Cortex-M1 Flash FPGAs development board
5. M1A3P1000 reference design
6. M1A3P1000L-FGG256I Datasheet PDF
7. M1A3P1000 development board
8. M1A3P1000 evaluation board
9. Microsemi Cortex-M1 Flash FPGAs development board
Xilinx M1A3P1000L-FGG256I TechnicalAttributes
-Supplier Device Package 256-FPBGA (17×17)
-Voltage – Supply 1.14V ~ 1.575V
-Total RAM Bits 147456
-Package / Case 256-LBGA
-Number of Gates 1000000
-Mounting Type Surface Mount
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of I/O 177