M1A3P400-2FGG256 -Medical Equipment -Internet of Things

M1A3P400-2FGG256 ApplicationField

-Cloud Computing
-Industrial Control
-Wireless Technology
-Consumer Electronics
-Artificial Intelligence
-Internet of Things
-5G Technology
-Medical Equipment

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M1A3P400-2FGG256 FAQ Chips 

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ICs M1A3P400-2FGG256 Features

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Xilinx M1A3P400-2FGG256 Overview

Flash Advantages
Reduced Cost of Ownership

Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike SRAMbased FPGAs, flash-based ProASIC3E devices allow all functionality to be Instant On; no external boot
PROM is required. On-board security mechanisms prevent access to all the programming information
and enable secure remote updates of the FPGA logic. Designers can perform secure remote in-system
reprogramming to support future design iterations and field upgrades with confidence that valuable
intellectual property (IP) cannot be compromised or copied. Secure ISP can be performed using the
industry-standard AES algorithm. The ProASIC3E family device architecture mitigates the need for ASIC
migration at higher user volumes. This makes the ProASIC3E family a cost-effective ASIC replacement
solution, especially for applications in the consumer, networking/ communications, computing, and
avionics markets.


The nonvolatile, flash-based ProASIC3E devices do not require a boot PROM, so there is no vulnerable
external bitstream that can be easily copied. ProASIC3E devices incorporate FlashLock, which provides
a unique combination of reprogrammability and design security without external overhead, advantages
that only an FPGA with nonvolatile flash programming can offer.

M1A3P400-2FGG256 Tags integrated circuit

1. M1A3P400 development board
2. Cortex-M1 Flash FPGAs starter kit
3. M1A3P400 evaluation board
4. Microsemi M1A3P400
5. M1A3P400 reference design
6. M1A3P400-2FGG256 Datasheet PDF
7. Microsemi Cortex-M1 Flash FPGAs development board
8. Cortex-M1 Flash FPGAs evaluation kit
9. Microsemi M1A3P400

Xilinx M1A3P400-2FGG256 TechnicalAttributes

-Total RAM Bits 55296
-Mounting Type Surface Mount
-Voltage – Supply 1.425V ~ 1.575V
-Package / Case 256-LBGA
-Supplier Device Package 256-FPBGA (17×17)

-Operating Temperature 0℃ ~ 85℃ (TJ)

-Number of I/O 178
-Number of Gates 400000

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