-Internet of Things
M1AGLE3000V2-FG896 FAQ Chips
Q: Where can I purchase Microsemi M1AGLE3000 Development Boards, Evaluation Boards, or IGLOOe Low-Power Flash FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
Q: How to obtain M1AGLE3000V2-FG896 technical support documents?
A: Enter the “M1AGLE3000V2-FG896” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
Q: What should I do if I did not receive the technical support for M1AGLE3000V2FG896 in time?
A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the M1AGLE3000V2-FG896 pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.
Q: Does the price of M1AGLE3000V2-FG896 devices fluctuate frequently?
A: The RAYPCB search engine monitors the M1AGLE3000V2-FG896 inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.
Q: How can I obtain software development tools related to the Microsemi FPGA platform?
A: The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
Q: Do I have to sign up on the website to make an inquiry for M1AGLE3000V2-FG896?
A: No, only submit the quantity, email address and other contact information required for the inquiry of M1AGLE3000V2-FG896, but you need to sign up for the post comments and resource downloads.
ICs M1AGLE3000V2-FG896 Features
Request M1AGLE3000V2-FG896 FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx M1AGLE3000V2-FG896 Overview
The IGLOOe family of flash FPGAs, based on a 130-nm flash process, offers the lowest power FPGA,
a single-chip solution, small footprint packages, reprogrammability, and an abundance of
The Flash*Freeze technology used in IGLOOe devices enables entering and exiting an ultra-lowpower mode while retaining SRAM and register data. Flash*Freeze technology simplifies power
management through I/O and clock management with rapid recovery to operation mode.
The Low Power Active capability (static idle) allows for ultra-low-power consumption while the
IGLOOe device is completely functional in the system. This allows the IGLOOe device to control
system power management based on external inputs (e.g., scanning for keyboard stimulus) while
consuming minimal power.
Nonvolatile flash technology gives IGLOOe devices the advantage of being a secure, low power,
single-chip solution that is live at power-up (LAPU). IGLOOe is reprogrammable and offers time-tomarket benefits at an ASIC-level unit cost.
These features enable designers to create high-density systems using existing ASIC or FPGA design
flows and tools.
The Microsemi Embedded – FPGAs (Field Programmable Gate Array) series M1AGLE3000V2-FG896 is IC FPGA 620 I/O 896FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
M1AGLE3000V2-FG896 Tags integrated circuit
1. IGLOOe Low-Power Flash FPGAs M1AGLE3000
2. IGLOOe Low-Power Flash FPGAs evaluation kit
3. M1AGLE3000V2-FG896 Datasheet PDF
4. Microsemi IGLOOe Low-Power Flash FPGAs development board
5. IGLOOe Low-Power Flash FPGAs starter kit
6. M1AGLE3000 evaluation board
7. M1AGLE3000 development board
8. M1AGLE3000 reference design
9. Microsemi IGLOOe Low-Power Flash FPGAs development board
Xilinx M1AGLE3000V2-FG896 TechnicalAttributes
-Voltage – Supply 1.14V ~ 1.575V
-Package / Case 896-BGA
-Supplier Device Package 896-FBGA (31×31)
-Mounting Type Surface Mount
-Total RAM Bits 516096
-Operating Temperature 0℃ ~ 70℃ (TA)
-Number of I/O 620
-Number of Gates 3000000
-Number of Logic Elements/Cells 75264