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M1AGLE3000V2-FGG896 FAQ Chips
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ICs M1AGLE3000V2-FGG896 Features
Request M1AGLE3000V2-FGG896 FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx M1AGLE3000V2-FGG896 Overview
The IGLOOe family of flash FPGAs, based on a 130-nm flash process, offers the lowest power FPGA,
a single-chip solution, small footprint packages, reprogrammability, and an abundance of
The Flash*Freeze technology used in IGLOOe devices enables entering and exiting an ultra-lowpower mode while retaining SRAM and register data. Flash*Freeze technology simplifies power
management through I/O and clock management with rapid recovery to operation mode.
The Low Power Active capability (static idle) allows for ultra-low-power consumption while the
IGLOOe device is completely functional in the system. This allows the IGLOOe device to control
system power management based on external inputs (e.g., scanning for keyboard stimulus) while
consuming minimal power.
Nonvolatile flash technology gives IGLOOe devices the advantage of being a secure, low power,
single-chip solution that is live at power-up (LAPU). IGLOOe is reprogrammable and offers time-tomarket benefits at an ASIC-level unit cost.
These features enable designers to create high-density systems using existing ASIC or FPGA design
flows and tools.
The Microsemi Embedded – FPGAs (Field Programmable Gate Array) series M1AGLE3000V2-FGG896 is IC FPGA 620 I/O 896FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
M1AGLE3000V2-FGG896 Tags integrated circuit
1. IGLOOe Low-Power Flash FPGAs M1AGLE3000
2. M1AGLE3000 reference design
3. M1AGLE3000V2-FGG896 Datasheet PDF
4. M1AGLE3000 development board
5. IGLOOe Low-Power Flash FPGAs evaluation kit
6. M1AGLE3000 evaluation board
7. IGLOOe Low-Power Flash FPGAs starter kit
8. Microsemi M1AGLE3000
9. M1AGLE3000 development board
Xilinx M1AGLE3000V2-FGG896 TechnicalAttributes
-Number of I/O 620
-Number of Gates 3000000
-Number of Logic Elements/Cells 75264
-Mounting Type Surface Mount
-Supplier Device Package 896-FBGA (31×31)
-Package / Case 896-BGA
-Operating Temperature 0℃ ~ 70℃ (TA)
-Voltage – Supply 1.14V ~ 1.575V
-Total RAM Bits 516096