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M1AGLE3000V2-FGG896I FAQ Chips
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ICs M1AGLE3000V2-FGG896I Features
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Xilinx M1AGLE3000V2-FGG896I Overview
The IGLOOe family of flash FPGAs, based on a 130-nm flash process, offers the lowest power FPGA,
a single-chip solution, small footprint packages, reprogrammability, and an abundance of
The Flash*Freeze technology used in IGLOOe devices enables entering and exiting an ultra-lowpower mode while retaining SRAM and register data. Flash*Freeze technology simplifies power
management through I/O and clock management with rapid recovery to operation mode.
The Low Power Active capability (static idle) allows for ultra-low-power consumption while the
IGLOOe device is completely functional in the system. This allows the IGLOOe device to control
system power management based on external inputs (e.g., scanning for keyboard stimulus) while
consuming minimal power.
Nonvolatile flash technology gives IGLOOe devices the advantage of being a secure, low power,
single-chip solution that is live at power-up (LAPU). IGLOOe is reprogrammable and offers time-tomarket benefits at an ASIC-level unit cost.
These features enable designers to create high-density systems using existing ASIC or FPGA design
flows and tools.
The Microsemi FPGA series M1AGLE3000V2-FGG896I is FPGA IGLOOe Family 3M Gates 526.32MHz/892.86MHz 130nm Technology 1.2V/1.5V 896-Pin FBGA Tray, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
M1AGLE3000V2-FGG896I Tags integrated circuit
1. M1AGLE3000V2-FGG896I Datasheet PDF
2. Microsemi IGLOOe Low-Power Flash FPGAs development board
3. IGLOOe Low-Power Flash FPGAs M1AGLE3000
4. Microsemi M1AGLE3000
5. IGLOOe Low-Power Flash FPGAs evaluation kit
6. M1AGLE3000 reference design
7. IGLOOe Low-Power Flash FPGAs starter kit
8. M1AGLE3000 development board
9. Microsemi M1AGLE3000
Xilinx M1AGLE3000V2-FGG896I TechnicalAttributes
-Number of I/O 620
-Mounting Type Surface Mount
-Package / Case 896-BGA
-Number of Gates 3000000
-Supplier Device Package 896-FBGA (31×31)
-Voltage – Supply 1.14V ~ 1.575V
-Total RAM Bits 516096
-Operating Temperature -40℃ ~ 85℃ (TA)
-Number of Logic Elements/Cells 75264