M2S060-1FG676 ApplicationField
-5G Technology
-Internet of Things
-Wireless Technology
-Medical Equipment
-Consumer Electronics
-Industrial Control
-Cloud Computing
-Artificial Intelligence
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M2S060-1FG676 FAQ Chips
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ICs M2S060-1FG676 Features
The FPGA with high level of integration at the lowest total system cost
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Xilinx M2S060-1FG676 Overview
Whether you’re designing at the board or system level, Microsemi’s SoC FPGAs and low power FPGAs are your best choice.
The unique, flash-based technology of Microsemi FPGAs, coupled with their history of reliability, sets them apart from traditional FPGAs.
Design for today’s rapidly growing markets of consumer and portable medical devices, or tomorrow’s environmentally friendly data
centers, industrial controls and military and commercial aircraft. Only Microsemi can meet the power, size, cost and reliability targets
that reduce time-to-market and enable long-term profitability.
The Microsemi Embedded – System On Chip (SoC) series M2S060-1FG676 is IC SOC CORTEX-M3 166MHZ 676FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
M2S060-1FG676 Tags integrated circuit
1. M2S060 reference design
2. M2S060-1FG676 Datasheet PDF
3. M2S060 evaluation board
4. SmartFusion2 SoC starter kit
5. Microsemi M2S060
6. SmartFusion2 SoC evaluation kit
7. Microsemi SmartFusion2 SoC development board
8. SmartFusion2 SoC M2S060
9. SmartFusion2 SoC starter kit
Xilinx M2S060-1FG676 TechnicalAttributes
-RAM Size 64KB
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Architecture MCU, FPGA
-Core Processor ARM? Cortex?-M3
-Speed 166MHz
-Flash Size 256KB
-Supplier Device Package 676-FBGA (27×27)
-Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
-Peripherals DDR, PCIe, SERDES
-Primary Attributes FPGA – 60K Logic Modules
-Package / Case 676-BGA