M2S090-1FGG484 -Wireless Technology -Internet of Things

M2S090-1FGG484 ApplicationField

-5G Technology
-Industrial Control
-Artificial Intelligence
-Cloud Computing
-Medical Equipment
-Internet of Things
-Consumer Electronics
-Wireless Technology

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M2S090-1FGG484 FAQ Chips 

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Q: How can I obtain software development tools related to the Microsemi FPGA platform?
A: The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: Where can I purchase Microsemi M2S090 Development Boards, Evaluation Boards, or SmartFusion2 SoC Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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ICs M2S090-1FGG484 Features

The FPGA with high level of integration at the lowest total system cost

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Xilinx M2S090-1FGG484 Overview

Whether you’re designing at the board or system level, Microsemi’s SoC FPGAs and low power FPGAs are your best choice.
The unique, flash-based technology of Microsemi FPGAs, coupled with their history of reliability, sets them apart from traditional FPGAs.
Design for today’s rapidly growing markets of consumer and portable medical devices, or tomorrow’s environmentally friendly data
centers, industrial controls and military and commercial aircraft. Only Microsemi can meet the power, size, cost and reliability targets
that reduce time-to-market and enable long-term profitability.
The Microsemi Embedded – System On Chip (SoC) series M2S090-1FGG484 is IC SOC CORTEX-M3 166MHZ 484FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

M2S090-1FGG484 Tags integrated circuit

1. Microsemi M2S090
2. SmartFusion2 SoC evaluation kit
3. Microsemi SmartFusion2 SoC development board
4. M2S090 reference design
5. M2S090-1FGG484 Datasheet PDF
6. SmartFusion2 SoC starter kit
7. M2S090 evaluation board
8. M2S090 development board
9. M2S090 reference design

Xilinx M2S090-1FGG484 TechnicalAttributes

-Operating Temperature 0℃ ~ 85℃ (TJ)
-Speed 166MHz
-Primary Attributes FPGA – 90K Logic Modules
-Flash Size 512KB
-Package / Case 484-BGA
-Core Processor ARM? Cortex?-M3
-Peripherals DDR, PCIe, SERDES
-Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
-Supplier Device Package 484-FPBGA (23×23)
-RAM Size 64KB

-Architecture MCU, FPGA

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