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M2S090-FG676I FAQ Chips
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Q: Where can I purchase Microsemi M2S090 Development Boards, Evaluation Boards, or SmartFusion2 SoC Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
ICs M2S090-FG676I Features
The FPGA with high level of integration at the lowest total system cost
Request M2S090-FG676I FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx M2S090-FG676I Overview
Whether you’re designing at the board or system level, Microsemi’s SoC FPGAs and low power FPGAs are your best choice.
The unique, flash-based technology of Microsemi FPGAs, coupled with their history of reliability, sets them apart from traditional FPGAs.
Design for today’s rapidly growing markets of consumer and portable medical devices, or tomorrow’s environmentally friendly data
centers, industrial controls and military and commercial aircraft. Only Microsemi can meet the power, size, cost and reliability targets
that reduce time-to-market and enable long-term profitability.
The Microsemi Embedded – System On Chip (SoC) series M2S090-FG676I is IC SOC CORTEX-M3 166MHZ 676FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
M2S090-FG676I Tags integrated circuit
1. M2S090 evaluation board
2. M2S090 development board
3. SmartFusion2 SoC evaluation kit
4. Microsemi M2S090
5. M2S090-FG676I Datasheet PDF
6. SmartFusion2 SoC starter kit
7. Microsemi SmartFusion2 SoC development board
8. M2S090 reference design
9. Microsemi M2S090
Xilinx M2S090-FG676I TechnicalAttributes
-Flash Size 512KB
-Core Processor ARM? Cortex?-M3
-Architecture MCU, FPGA
-Primary Attributes FPGA – 90K Logic Modules
-Operating Temperature -40℃ ~ 100℃ (TJ)
-RAM Size 64KB
-Peripherals DDR, PCIe, SERDES
-Package / Case 676-BGA
-Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
-Supplier Device Package 676-FBGA (27×27)