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M2S150-FCV484I FAQ Chips
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Q: Where can I purchase Microsemi M2S150 Development Boards, Evaluation Boards, or SmartFusion2 SoC Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
ICs M2S150-FCV484I Features
The FPGA with high level of integration at the lowest total system cost
Request M2S150-FCV484I FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx M2S150-FCV484I Overview
Whether you’re designing at the board or system level, Microsemi’s SoC FPGAs and low power FPGAs are your best choice. The unique, flash-based technology of Microsemi FPGAs, coupled with their history of reliability, sets them apart from traditional FPGAs. Design for today’s rapidly growing markets of consumer and portable medical devices, or tomorrow’s environmentally friendly data centers, industrial controls and military and commercial aircraft. Only Microsemi can meet the power, size, cost and reliability targets that reduce time-to-market and enable long-term profitability.
The Microsemi Embedded – System On Chip (SoC) series M2S150-FCV484I is IC SOC CORTEX-M3 166MHZ 484FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
M2S150-FCV484I Tags integrated circuit
1. SmartFusion2 SoC starter kit
2. SmartFusion2 SoC M2S150
3. M2S150 development board
4. Microsemi SmartFusion2 SoC development board
5. Microsemi M2S150
6. M2S150 reference design
7. SmartFusion2 SoC evaluation kit
8. M2S150-FCV484I Datasheet PDF
9. Microsemi SmartFusion2 SoC development board
Xilinx M2S150-FCV484I TechnicalAttributes
-Flash Size 512KB
-Package / Case 484-BFBGA
-RAM Size 64KB
-Primary Attributes FPGA – 150K Logic Modules
-Supplier Device Package 484-FBGA (19×19)
-Core Processor ARM? Cortex?-M3
-Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
-Peripherals DDR, PCIe, SERDES
-Architecture MCU, FPGA
-Operating Temperature -40℃ ~ 100℃ (TJ)