M2S150TS-1FCV484 -Artificial Intelligence -Internet of Things

M2S150TS-1FCV484 ApplicationField

-Industrial Control
-Consumer Electronics
-Wireless Technology
-Medical Equipment
-5G Technology
-Internet of Things
-Cloud Computing
-Artificial Intelligence

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M2S150TS-1FCV484 FAQ Chips 

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Q: Where can I purchase Microsemi M2S150 Development Boards, Evaluation Boards, or SmartFusion2 SoC Starter Kit? also provide technical information?
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ICs M2S150TS-1FCV484 Features

The FPGA with high level of integration at the lowest total system cost

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Xilinx M2S150TS-1FCV484 Overview

Whether you’re designing at the board or system level, Microsemi’s SoC FPGAs and low power FPGAs are your best choice. The unique, flash-based technology of Microsemi FPGAs, coupled with their history of reliability, sets them apart from traditional FPGAs. Design for today’s rapidly growing markets of consumer and portable medical devices, or tomorrow’s environmentally friendly data centers, industrial controls and military and commercial aircraft. Only Microsemi can meet the power, size, cost and reliability targets that reduce time-to-market and enable long-term profitability.
The Microsemi Embedded – System On Chip (SoC) series M2S150TS-1FCV484 is IC SOC CORTEX-M3 166MHZ 484FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

M2S150TS-1FCV484 Tags integrated circuit

1. Microsemi SmartFusion2 SoC development board
2. M2S150 development board
3. M2S150 evaluation board
4. SmartFusion2 SoC starter kit
5. SmartFusion2 SoC M2S150
6. M2S150TS-1FCV484 Datasheet PDF
7. SmartFusion2 SoC evaluation kit
8. M2S150 reference design
9. SmartFusion2 SoC starter kit

Xilinx M2S150TS-1FCV484 TechnicalAttributes

-Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
-Primary Attributes FPGA – 150K Logic Modules
-Flash Size 512KB
-Architecture MCU, FPGA
-Core Processor ARM? Cortex?-M3
-Package / Case 484-BFBGA
-RAM Size 64KB
-Speed 166MHz
-Supplier Device Package 484-FBGA (19×19)
-Peripherals DDR, PCIe, SERDES

-Operating Temperature 0℃ ~ 85℃ (TJ)