M7A3P1000-2FG256 ApplicationField
-5G Technology
-Artificial Intelligence
-Wireless Technology
-Industrial Control
-Cloud Computing
-Consumer Electronics
-Medical Equipment
-Internet of Things
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M7A3P1000-2FG256 FAQ Chips
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ICs M7A3P1000-2FG256 Features
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Xilinx M7A3P1000-2FG256 Overview
ProASIC3, the third-generation family of Microsemi flash FPGAs, offers performance, density, and
features beyond those of the ProASICPLUS family. Nonvolatile flash technology gives ProASIC3 devices
the advantage of being a secure, low power, single-chip solution that is Instant On. ProASIC3 is
reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable
designers to create high-density systems using existing ASIC or FPGA design flows and tools.
ProASIC3 devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as
clock conditioning circuitry based on an integrated phase-locked loop (PLL). The A3P015 and A3P030
devices have no PLL or RAM support. ProASIC3 devices have up to 1 million system gates, supported
with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os.
ProASIC3 devices support the ARM Cortex-M1 processor. The ARM-enabled devices have Microsemi
ordering numbers that begin with M1A3P (Cortex-M1) and do not support AES decryption.
The Microsemi Embedded – FPGAs (Field Programmable Gate Array) series M7A3P1000-2FG256 is IC FPGA 177 I/O 256FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
M7A3P1000-2FG256 Tags integrated circuit
1. M7A3P1000-2FG256 Datasheet PDF
2. Microsemi ProASIC3 Flash FPGAs development board
3. ProASIC3 Flash FPGAs evaluation kit
4. ProASIC3 Flash FPGAs starter kit
5. M7A3P1000 development board
6. M7A3P1000 reference design
7. ProASIC3 Flash FPGAs M7A3P1000
8. M7A3P1000 evaluation board
9. ProASIC3 Flash FPGAs starter kit
Xilinx M7A3P1000-2FG256 TechnicalAttributes
-Mounting Type Surface Mount
-Number of I/O 177
-Supplier Device Package 256-FPBGA (17×17)
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Package / Case 256-LBGA
-Number of Gates 1000000
-Voltage – Supply 1.425V ~ 1.575V
-Total RAM Bits 147456