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M7AFS600-2FGG484 FAQ Chips
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ICs M7AFS600-2FGG484 Features
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Xilinx M7AFS600-2FGG484 Overview
The Fusion mixed signal FPGA satisfies the demand from system architects for a device that simplifies
design and unleashes their creativity. As the world’s first mixed signal programmable logic family, Fusion
integrates mixed signal analog, flash memory, and FPGA fabric in a monolithic device. Fusion devices
enable designers to quickly move from concept to completed design and then deliver feature-rich
systems to market. This new technology takes advantage of the unique properties of Microsemi
flash-based FPGAs, including a high-isolation, triple-well process and the ability to support high-voltage
transistors to meet the demanding requirements of mixed signal system design.
Fusion mixed signal FPGAs bring the benefits of programmable logic to many application areas,
including power management, smart battery charging, clock generation and management, and motor
control. Until now, these applications have only been implemented with costly and space-consuming
discrete analog components or mixed signal ASIC solutions. Fusion mixed signal FPGAs present new
capabilities for system development by allowing designers to integrate a wide range of functionality into a
single device, while at the same time offering the flexibility of upgrades late in the manufacturing process
or after the device is in the field.
Fusion devices provide an excellent alternative to costly and
time-consuming mixed signal ASIC designs. In addition, when used in conjunction with the ARM
Cortex-M1 processor, Fusion technology represents the definitive mixed signal FPGA platform.
The Microsemi Embedded – FPGAs (Field Programmable Gate Array) series M7AFS600-2FGG484 is IC FPGA 172 I/O 484FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
M7AFS600-2FGG484 Tags integrated circuit
1. M7AFS600 evaluation board
2. Fusion of Mixed Signal FPGAs evaluation kit
3. M7AFS600 development board
4. M7AFS600 reference design
5. Microsemi Fusion of Mixed Signal FPGAs development board
6. Fusion of Mixed Signal FPGAs M7AFS600
7. Microsemi M7AFS600
8. M7AFS600-2FGG484 Datasheet PDF
9. M7AFS600 reference design
Xilinx M7AFS600-2FGG484 TechnicalAttributes
-Operating Temperature 0℃ ~ 70℃ (TA)
-Supplier Device Package 484-FPBGA (23×23)
-Mounting Type Surface Mount
-Total RAM Bits 110592
-Package / Case 484-BGA
-Voltage – Supply 1.425V ~ 1.575V
-Number of Gates 600000
-Number of I/O 172