MPF300T-FCG1152I -Industrial Control -Wireless Technology

MPF300T-FCG1152I ApplicationField

-Internet of Things
-5G Technology
-Cloud Computing
-Artificial Intelligence
-Medical Equipment
-Wireless Technology
-Consumer Electronics
-Industrial Control

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MPF300T-FCG1152I FAQ Chips 

Q: Where can I purchase Microsemi MPF300T Development Boards, Evaluation Boards, or PolarFire FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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ICs MPF300T-FCG1152I Features

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Xilinx MPF300T-FCG1152I Overview

Award-winning PolarFire FPGAs deliver the industry’s lowest power at mid-range densities with exceptional security and reliability. The product family spans from 100K logic elements (LEs) to 500K LEs, features 12.7G transceivers and offers up to 50% lower power than competing mid-range FPGAs. The devices are ideal for a wide range of applications within wireline access networks and cellular infrastructure, defense and commercial aviation markets, as well as industrial automation and IoT markets. Get started with your design today by downloading the Libero SoC PolarFire Design Suite and ordering a PolarFire development kit that best matches your needs.

Architecture and process optimizations for 100K/500K LE devices

Transceiver performance optimized for 12.7 Gbps, which yields smaller size

1.6 Gbps I/Os supporting DDR4/DDR3/LPDDR3, LVDS – hardened I/O gearing logic with CDR (supports SGMII/GbE links on GPIOs)

Best-in-class high-performance, hardened security IP in mid-range devices

The lowest static power—1/10 static power vs. competing devices

Transceiver optimized for 12.7 Gbps, which yields 1/2 the power vs. competing devices

Integrated hard IP—DDR PHY, PCIe endpoint/root port, crypto processor

Total power (static and dynamic)—up to 50% lower power

PolarFire FPGAs deliver up to 500K logic elements, 12.7G transceivers at 50% lower power.

PolarFire FPGAs offer various device offerings such as design security with transceivers, low power transceiver devices, data security with transceivers, and low power data security with transceiver devices. All PolarFire FPGAs are integrated with multi-protocol industry-leading low-power transceivers. Low power (L) devices provide up to 35% lower static power. Also, data security (S) devices have an integrated DPA safe crypto accelerator. PolarFire Devices are currently offered in Extended Commercial (0ºC to 100ºC) and Industrial (–40ºC to 100ºC) device offerings.

PolarFire cost-optimized FPGAs deliver the lowest power at mid-range densities with 12.7 Gbps SerDes transceivers as well as best-in-class security and reliability. They offer unprecedented capabilities and value with 10G transceivers, advanced I/Os, security and DSP capabilities while maintaining all the advantages traditionally associated with non-volatile FPGAs such as static power, security and single event upset (SEU) immunity. The devices are ideal for a wide range of applications within wireline access networks and cellular infrastructure, defense and commercial aviation markets, as well as industrial automation and IoT Markets

The Microsemi Embedded – FPGAs (Field Programmable Gate Array) series MPF300T-FCG1152I is IC FPGA 512 I/O 1152FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

MPF300T-FCG1152I Tags integrated circuit

1. MPF300T reference design
2. MPF300T development board
3. PolarFire FPGAs MPF300T
4. Microsemi PolarFire FPGAs development board
5. MPF300T-FCG1152I Datasheet PDF
6. MPF300T evaluation board
7. PolarFire FPGAs starter kit
8. PolarFire FPGAs evaluation kit
9. Microsemi PolarFire FPGAs development board

Xilinx MPF300T-FCG1152I TechnicalAttributes

-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of Logic Elements/Cells 300000
-Package / Case 1152-BBGA, FCBGA
-Mounting Type Surface Mount
-Total RAM Bits 21094400

-Supplier Device Package 1152-FCBGA (35×35)

-Number of I/O 512
-Voltage – Supply 0.97V ~ 1.08V

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