P1AFS600-2FGG256 -Industrial Control -Cloud Computing

P1AFS600-2FGG256 ApplicationField

-Consumer Electronics
-Artificial Intelligence
-5G Technology
-Internet of Things
-Wireless Technology
-Cloud Computing
-Medical Equipment
-Industrial Control

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P1AFS600-2FGG256 FAQ Chips 

Q: How can I obtain software development tools related to the Microsemi FPGA platform?
A: The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: Where can I purchase Microsemi P1AFS600 Development Boards, Evaluation Boards, or Fusion of Mixed Signal FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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Q: How to obtain P1AFS600-2FGG256 technical support documents?
A: Enter the “P1AFS600-2FGG256” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: Does the price of P1AFS600-2FGG256 devices fluctuate frequently?
A: The RAYPCB search engine monitors the P1AFS600-2FGG256 inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.

ICs P1AFS600-2FGG256 Features

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Xilinx P1AFS600-2FGG256 Overview

The Fusion mixed signal FPGA satisfies the demand from system architects for a device that simplifies
design and unleashes their creativity. As the world’s first mixed signal programmable logic family, Fusion
integrates mixed signal analog, flash memory, and FPGA fabric in a monolithic device. Fusion devices
enable designers to quickly move from concept to completed design and then deliver feature-rich
systems to market. This new technology takes advantage of the unique properties of Microsemi
flash-based FPGAs, including a high-isolation, triple-well process and the ability to support high-voltage
transistors to meet the demanding requirements of mixed signal system design.

Fusion mixed signal FPGAs bring the benefits of programmable logic to many application areas,
including power management, smart battery charging, clock generation and management, and motor
control. Until now, these applications have only been implemented with costly and space-consuming
discrete analog components or mixed signal ASIC solutions. Fusion mixed signal FPGAs present new
capabilities for system development by allowing designers to integrate a wide range of functionality into a
single device, while at the same time offering the flexibility of upgrades late in the manufacturing process
or after the device is in the field. Fusion devices provide an excellent alternative to costly and
time-consuming mixed signal ASIC designs. In addition, when used in conjunction with the ARM
Cortex-M1 processor, Fusion technology represents the definitive mixed signal FPGA platform.

The Microsemi Embedded – FPGAs (Field Programmable Gate Array) series P1AFS600-2FGG256 is FPGA Fusion Family 600K Gates 1470.59MHz 130nm Technology 1.5V 256Pin FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

P1AFS600-2FGG256 Tags integrated circuit

1. Fusion of Mixed Signal FPGAs evaluation kit
2. P1AFS600-2FGG256 Datasheet PDF
3. Fusion of Mixed Signal FPGAs starter kit
4. Fusion of Mixed Signal FPGAs P1AFS600
5. Microsemi Fusion of Mixed Signal FPGAs development board
6. P1AFS600 development board
7. P1AFS600 evaluation board
8. Microsemi P1AFS600
9. Fusion of Mixed Signal FPGAs P1AFS600

Xilinx P1AFS600-2FGG256 TechnicalAttributes

-Number of I/O 119
-Number of Gates 600000
-Mounting Type Surface Mount
-Supplier Device Package 256-FPBGA (17×17)
-Voltage – Supply 1.425V ~ 1.575V

-Total RAM Bits 110592

-Package / Case 256-LBGA
-Operating Temperature 0℃ ~ 85℃ (TJ)

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