XA3S1000-4FGG456I ApplicationField
-Wireless Technology
-Medical Equipment
-Cloud Computing
-Industrial Control
-Internet of Things
-Artificial Intelligence
-5G Technology
-Consumer Electronics
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XA3S1000-4FGG456I FAQ Chips
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ICs XA3S1000-4FGG456I Features
♦ Termination by Digitally Controlled Impedance
• Logic resources
• SelectIO interface signaling
• Guaranteed to meet full electrical specification over the TJ = –40°C to +125°C temperature range
♦ Up to 487 I/O pins
♦ Double Data Rate (DDR) support
♦ Eighteen single-ended signal standards
• AEC-Q100 device qualification and full PPAP documentation support available in both extended temperature Q-grade and I-grade
♦ 622 Mb/s data transfer rate per I/O
♦ Signal swing ranging from 1.14V to 3.45V
♦ Wide multiplexers
♦ Eight differential signal standards including LVDS
• Revolutionary 90-nanometer process technology
♦ Abundant logic cells with shift register capability
• Low cost, high-performance logic solution for high-volume, automotive applications
♦ Three power rails: for core (1.2V), I/Os (1.2V to 3.3V), and auxiliary purposes (2.5V)
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Xilinx XA3S1000-4FGG456I Overview
The Xilinx XA3S1000-4FGG456I of Field-Programmable Gate Arrays meets the needs of high-volume, cost-sensitive automotive electronic applications. The five-member family offers densities ranging from 50,000 to 1.5 million system gates.XA devices are available in both extended-temperature Q-grade (–40°C to +125°C TJ) and I-grade (–40°C to +100°C TJ) and are qualified to the industry-recognized AEC-Q100 standard. The XA3S1000-4FGG456I builds on the success of the earlier XA Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. These Spartan-3 enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XA3S1000-4FGG456I FPGAs are ideally suited to a wide range of advanced automotive electronics modules and systems ranging from the latest driver assistance and infotainment systems to instrument clusters and gateways. The XA3S1000-4FGG456I is a flexible alternative to ASICs, ASSPs, and microcontrollers. FPGAs avoid the high initial NREs, the lengthy development cycles, and problems with obsolescence. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary.
The Xilinx Microcontrôlleur 8 Bit series XA3S1000-4FGG456I is XA3S1000-4FG456I, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XA3S1000-4FGG456I Tags integrated circuit
1. Xilinx XA Spartan-3 Automotive FPGA development board
2. XA3S1000 evaluation board
3. Xilinx XA3S1000
4. XA Spartan-3 Automotive FPGA XA3S1000
5. XA Spartan-3 Automotive FPGA starter kit
6. XA3S1000-4FGG456I Datasheet PDF
7. XA3S1000 reference design
8. XA3S1000 development board
9. XA Spartan-3 Automotive FPGA XA3S1000
Xilinx XA3S1000-4FGG456I TechnicalAttributes
-Total RAM Bits 442368
-Voltage – Supply 1.14V ~ 1.26V
-Number of I/O 333
-Supplier Device Package 456-FBGA (23×23)
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of Gates 1000000
-Number of Logic Elements/Cells 17280
-Mounting Type Surface Mount
-Number of LABs/CLBs 1920
-Package / Case 456-BBGA
