XA3S1000-4FTG256Q ApplicationField
-Consumer Electronics
-Wireless Technology
-Medical Equipment
-Cloud Computing
-Industrial Control
-Internet of Things
-5G Technology
-Artificial Intelligence
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XA3S1000-4FTG256Q FAQ Chips
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ICs XA3S1000-4FTG256Q Features
♦ Three power rails: for core (1.2V), I/Os (1.2V to 3.3V), and auxiliary purposes (2.5V)
♦ Eighteen single-ended signal standards
♦ Abundant logic cells with shift register capability
• Guaranteed to meet full electrical specification over the TJ = –40°C to +125°C temperature range
♦ Double Data Rate (DDR) support
• Logic resources
• AEC-Q100 device qualification and full PPAP documentation support available in both extended temperature Q-grade and I-grade
♦ Eight differential signal standards including LVDS
• SelectIO interface signaling
♦ 622 Mb/s data transfer rate per I/O
• Low cost, high-performance logic solution for high-volume, automotive applications
♦ Termination by Digitally Controlled Impedance
♦ Signal swing ranging from 1.14V to 3.45V
• Revolutionary 90-nanometer process technology
♦ Wide multiplexers
♦ Up to 487 I/O pins
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Xilinx XA3S1000-4FTG256Q Overview
The Xilinx XA3S1000-4FTG256Q of Field-Programmable Gate Arrays meets the needs of high-volume, cost-sensitive automotive electronic applications. The five-member family offers densities ranging from 50,000 to 1.5 million system gates.XA devices are available in both extended-temperature Q-grade (–40°C to +125°C TJ) and I-grade (–40°C to +100°C TJ) and are qualified to the industry-recognized AEC-Q100 standard. The XA3S1000-4FTG256Q builds on the success of the earlier XA Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. These Spartan-3 enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XA3S1000-4FTG256Q FPGAs are ideally suited to a wide range of advanced automotive electronics modules and systems ranging from the latest driver assistance and infotainment systems to instrument clusters and gateways. The XA3S1000-4FTG256Q is a flexible alternative to ASICs, ASSPs, and microcontrollers. FPGAs avoid the high initial NREs, the lengthy development cycles, and problems with obsolescence. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary.
The Xilinx Accessoire de fusible series XA3S1000-4FTG256Q is Adapter; tube fuses; 6,3x32mm; 10A; 250V; -25÷70℃, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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XA3S1000-4FTG256Q Tags integrated circuit
1. XA Spartan-3 Automotive FPGA starter kit
2. XA Spartan-3 Automotive FPGA XA3S1000
3. XA3S1000 development board
4. XA3S1000 reference design
5. Xilinx XA Spartan-3 Automotive FPGA development board
6. XA3S1000-4FTG256Q Datasheet PDF
7. Xilinx XA3S1000
8. XA Spartan-3 Automotive FPGA evaluation kit
9. XA3S1000 reference design
Xilinx XA3S1000-4FTG256Q TechnicalAttributes
-Package / Case 256-LBGA
-Number of I/O 173
-Supplier Device Package 256-FTBGA (17×17)
-Voltage – Supply 1.14V ~ 1.26V
-Total RAM Bits 442368
-Number of LABs/CLBs 1920
-Operating Temperature -40℃ ~ 125℃ (TJ)
-Number of Gates 1000000
-Mounting Type Surface Mount
-Number of Logic Elements/Cells 17280