XA3S200-4TQG144I ApplicationField
-Cloud Computing
-Industrial Control
-Consumer Electronics
-Medical Equipment
-Wireless Technology
-Internet of Things
-Artificial Intelligence
-5G Technology
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XA3S200-4TQG144I FAQ Chips
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ICs XA3S200-4TQG144I Features
♦ Double Data Rate (DDR) support
• Guaranteed to meet full electrical specification over the TJ = –40°C to +125°C temperature range
♦ Eight differential signal standards including LVDS
♦ Abundant logic cells with shift register capability
• Low cost, high-performance logic solution for high-volume, automotive applications
♦ Termination by Digitally Controlled Impedance
♦ 622 Mb/s data transfer rate per I/O
♦ Up to 487 I/O pins
♦ Three power rails: for core (1.2V), I/Os (1.2V to 3.3V), and auxiliary purposes (2.5V)
♦ Wide multiplexers
♦ Eighteen single-ended signal standards
• SelectIO interface signaling
♦ Signal swing ranging from 1.14V to 3.45V
• Revolutionary 90-nanometer process technology
• Logic resources
• AEC-Q100 device qualification and full PPAP documentation support available in both extended temperature Q-grade and I-grade
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Xilinx XA3S200-4TQG144I Overview
The Xilinx XA3S200-4TQG144I of Field-Programmable Gate Arrays meets the needs of high-volume, cost-sensitive automotive electronic applications. The five-member family offers densities ranging from 50,000 to 1.5 million system gates.XA devices are available in both extended-temperature Q-grade (–40°C to +125°C TJ) and I-grade (–40°C to +100°C TJ) and are qualified to the industry-recognized AEC-Q100 standard. The XA3S200-4TQG144I builds on the success of the earlier XA Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. These Spartan-3 enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XA3S200-4TQG144I FPGAs are ideally suited to a wide range of advanced automotive electronics modules and systems ranging from the latest driver assistance and infotainment systems to instrument clusters and gateways. The XA3S200-4TQG144I is a flexible alternative to ASICs, ASSPs, and microcontrollers. FPGAs avoid the high initial NREs, the lengthy development cycles, and problems with obsolescence. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary.
The Xilinx Batterie series XA3S200-4TQG144I is Lithium Battery Cylindrical 3.6V 19Ah D Primary, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XA3S200-4TQG144I Tags integrated circuit
1. Xilinx XA3S200
2. XA3S200-4TQG144I Datasheet PDF
3. XA3S200 development board
4. XA3S200 reference design
5. XA3S200 evaluation board
6. XA Spartan-3 Automotive FPGA evaluation kit
7. XA Spartan-3 Automotive FPGA starter kit
8. XA Spartan-3 Automotive FPGA XA3S200
9. XA3S200 reference design
Xilinx XA3S200-4TQG144I TechnicalAttributes
-Number of I/O 97
-Voltage – Supply 1.14V ~ 1.26V
-Mounting Type Surface Mount
-Number of Gates 200000
-Number of Logic Elements/Cells 4320
-Supplier Device Package 144-TQFP (20×20)
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of LABs/CLBs 480
-Total RAM Bits 221184
-Package / Case 144-LQFP
