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XA3S400-4FGG456Q FAQ Chips
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A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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ICs XA3S400-4FGG456Q Features
♦ Termination by Digitally Controlled Impedance
• Low cost, high-performance logic solution for high-volume, automotive applications
♦ Abundant logic cells with shift register capability
♦ Eighteen single-ended signal standards
♦ Wide multiplexers
♦ Three power rails: for core (1.2V), I/Os (1.2V to 3.3V), and auxiliary purposes (2.5V)
♦ Signal swing ranging from 1.14V to 3.45V
♦ Eight differential signal standards including LVDS
♦ 622 Mb/s data transfer rate per I/O
♦ Double Data Rate (DDR) support
♦ Up to 487 I/O pins
• AEC-Q100 device qualification and full PPAP documentation support available in both extended temperature Q-grade and I-grade
• Revolutionary 90-nanometer process technology
• Logic resources
• SelectIO interface signaling
• Guaranteed to meet full electrical specification over the TJ = –40°C to +125°C temperature range
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Xilinx XA3S400-4FGG456Q Overview
The Xilinx XA3S400-4FGG456Q of Field-Programmable Gate Arrays meets the needs of high-volume, cost-sensitive automotive electronic applications. The five-member family offers densities ranging from 50,000 to 1.5 million system gates.XA devices are available in both extended-temperature Q-grade (–40°C to +125°C TJ) and I-grade (–40°C to +100°C TJ) and are qualified to the industry-recognized AEC-Q100 standard. The XA3S400-4FGG456Q builds on the success of the earlier XA Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. These Spartan-3 enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XA3S400-4FGG456Q FPGAs are ideally suited to a wide range of advanced automotive electronics modules and systems ranging from the latest driver assistance and infotainment systems to instrument clusters and gateways. The XA3S400-4FGG456Q is a flexible alternative to ASICs, ASSPs, and microcontrollers. FPGAs avoid the high initial NREs, the lengthy development cycles, and problems with obsolescence. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary.
The Xilinx FPGAs series XA3S400-4FGG456Q is FPGA Spartan -3 Family 400K Gates 8064 Cells 90nm Technology 1.2V 456Pin FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XA3S400-4FGG456Q Tags integrated circuit
1. XA Spartan-3 Automotive FPGA starter kit
2. XA3S400 reference design
3. XA3S400-4FGG456Q Datasheet PDF
4. XA Spartan-3 Automotive FPGA evaluation kit
5. Xilinx XA3S400
6. XA3S400 development board
7. XA Spartan-3 Automotive FPGA XA3S400
8. Xilinx XA Spartan-3 Automotive FPGA development board
9. XA Spartan-3 Automotive FPGA evaluation kit
Xilinx XA3S400-4FGG456Q TechnicalAttributes
-Voltage – Supply 1.14V ~ 1.26V
-Number of I/O 264
-Operating Temperature -40℃ ~ 125℃ (TJ)
-Number of LABs/CLBs 896
-Package / Case 456-BBGA
-Total RAM Bits 294912
-Mounting Type Surface Mount
-Number of Gates 400000
-Supplier Device Package 456-FBGA (23×23)
-Number of Logic Elements/Cells 8064