XA3S400-4FTG256I ApplicationField
-Medical Equipment
-Consumer Electronics
-Industrial Control
-Artificial Intelligence
-Wireless Technology
-Internet of Things
-Cloud Computing
-5G Technology
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XA3S400-4FTG256I FAQ Chips
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ICs XA3S400-4FTG256I Features
♦ Eight differential signal standards including LVDS
• AEC-Q100 device qualification and full PPAP documentation support available in both extended temperature Q-grade and I-grade
• Logic resources
♦ Up to 487 I/O pins
♦ Three power rails: for core (1.2V), I/Os (1.2V to 3.3V), and auxiliary purposes (2.5V)
♦ Abundant logic cells with shift register capability
♦ Signal swing ranging from 1.14V to 3.45V
♦ Wide multiplexers
• Guaranteed to meet full electrical specification over the TJ = –40°C to +125°C temperature range
♦ Double Data Rate (DDR) support
• Revolutionary 90-nanometer process technology
• Low cost, high-performance logic solution for high-volume, automotive applications
♦ 622 Mb/s data transfer rate per I/O
• SelectIO interface signaling
♦ Termination by Digitally Controlled Impedance
♦ Eighteen single-ended signal standards
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Xilinx XA3S400-4FTG256I Overview
The Xilinx XA3S400-4FTG256I of Field-Programmable Gate Arrays meets the needs of high-volume, cost-sensitive automotive electronic applications. The five-member family offers densities ranging from 50,000 to 1.5 million system gates.XA devices are available in both extended-temperature Q-grade (–40°C to +125°C TJ) and I-grade (–40°C to +100°C TJ) and are qualified to the industry-recognized AEC-Q100 standard. The XA3S400-4FTG256I builds on the success of the earlier XA Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. These Spartan-3 enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XA3S400-4FTG256I FPGAs are ideally suited to a wide range of advanced automotive electronics modules and systems ranging from the latest driver assistance and infotainment systems to instrument clusters and gateways. The XA3S400-4FTG256I is a flexible alternative to ASICs, ASSPs, and microcontrollers. FPGAs avoid the high initial NREs, the lengthy development cycles, and problems with obsolescence. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary.
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XA3S400-4FTG256I Tags integrated circuit
1. XA3S400 reference design
2. XA Spartan-3 Automotive FPGA starter kit
3. Xilinx XA3S400
4. XA3S400-4FTG256I Datasheet PDF
5. XA Spartan-3 Automotive FPGA XA3S400
6. XA3S400 development board
7. Xilinx XA Spartan-3 Automotive FPGA development board
8. XA Spartan-3 Automotive FPGA evaluation kit
9. XA3S400-4FTG256I Datasheet PDF
Xilinx XA3S400-4FTG256I TechnicalAttributes
-Number of I/O 173
-Package / Case 256-LBGA
-Number of Gates 400000
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Mounting Type Surface Mount
-Number of LABs/CLBs 896
-Voltage – Supply 1.14V ~ 1.26V
-Supplier Device Package 256-FTBGA (17×17)
-Number of Logic Elements/Cells 8064
-Total RAM Bits 294912