XA3S500E-4FTG256I ApplicationField
-Wireless Technology
-Cloud Computing
-Medical Equipment
-Internet of Things
-Industrial Control
-Artificial Intelligence
-Consumer Electronics
-5G Technology
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XA3S500E-4FTG256I FAQ Chips
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A: Enter the “XA3S500E-4FTG256I” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
Q: Where can I purchase Xilinx XA3S50 Development Boards, Evaluation Boards, or XA Spartan-3 Automotive FPGA Starter Kit? also provide technical information?
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
ICs XA3S500E-4FTG256I Features
♦ 622 Mb/s data transfer rate per I/O
♦ Abundant logic cells with shift register capability
♦ Up to 487 I/O pins
♦ Three power rails: for core (1.2V), I/Os (1.2V to 3.3V), and auxiliary purposes (2.5V)
♦ Termination by Digitally Controlled Impedance
• Revolutionary 90-nanometer process technology
♦ Eight differential signal standards including LVDS
♦ Signal swing ranging from 1.14V to 3.45V
• Logic resources
• SelectIO interface signaling
♦ Eighteen single-ended signal standards
• AEC-Q100 device qualification and full PPAP documentation support available in both extended temperature Q-grade and I-grade
• Low cost, high-performance logic solution for high-volume, automotive applications
♦ Double Data Rate (DDR) support
♦ Wide multiplexers
• Guaranteed to meet full electrical specification over the TJ = –40°C to +125°C temperature range
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Xilinx XA3S500E-4FTG256I Overview
The Xilinx XA3S500E-4FTG256I of Field-Programmable Gate Arrays meets the needs of high-volume, cost-sensitive automotive electronic applications. The five-member family offers densities ranging from 50,000 to 1.5 million system gates.XA devices are available in both extended-temperature Q-grade (–40°C to +125°C TJ) and I-grade (–40°C to +100°C TJ) and are qualified to the industry-recognized AEC-Q100 standard. The XA3S500E-4FTG256I builds on the success of the earlier XA Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. These Spartan-3 enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XA3S500E-4FTG256I FPGAs are ideally suited to a wide range of advanced automotive electronics modules and systems ranging from the latest driver assistance and infotainment systems to instrument clusters and gateways. The XA3S500E-4FTG256I is a flexible alternative to ASICs, ASSPs, and microcontrollers. FPGAs avoid the high initial NREs, the lengthy development cycles, and problems with obsolescence. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary.
The Xilinx FPGAs series XA3S500E-4FTG256I is FPGA XA Spartan-3E Family 500K Gates 10476 Cells 572MHz 90nm Technology 1.2V 256Pin FTBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XA3S500E-4FTG256I Tags integrated circuit
1. XA3S50 development board
2. XA Spartan-3 Automotive FPGA starter kit
3. XA3S50 evaluation board
4. XA Spartan-3 Automotive FPGA XA3S50
5. Xilinx XA Spartan-3 Automotive FPGA development board
6. XA Spartan-3 Automotive FPGA evaluation kit
7. Xilinx XA3S50
8. XA3S50 reference design
9. XA Spartan-3 Automotive FPGA XA3S50
Xilinx XA3S500E-4FTG256I TechnicalAttributes
-Package / Case 256-LBGA
-Number of Gates 500000
-Supplier Device Package 256-FTBGA (17×17)
-Number of LABs/CLBs 1164
-Voltage – Supply 1.14V ~ 1.26V
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Total RAM Bits 368640
-Number of Logic Elements/Cells 10476
-Mounting Type Surface Mount
-Number of I/O 190