XC2V1000-5FGG456C -Industrial Control -Internet of Things

XC2V1000-5FGG456C ApplicationField

-5G Technology
-Artificial Intelligence
-Medical Equipment
-Consumer Electronics
-Cloud Computing
-Internet of Things
-Wireless Technology
-Industrial Control

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XC2V1000-5FGG456C FAQ Chips 

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ICs XC2V1000-5FGG456C Features

Flexible Logic Resources

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Xilinx XC2V1000-5FGG456C Overview

General Description 

The Virtex-II family is a platform FPGA developed for high
performance from low-density to high-density designs that
are based on IP cores and customized modules. The family
delivers complete solutions for telecommunication, wireless,
networking, video, and DSP applications, including
PCI, LVDS, and DDR interfaces. 

The leading-edge 0.15 µm / 0.12 µm CMOS 8-layer metal
process and the Virtex-II architecture are optimized for high
speed with low power consumption. Combining a wide variety
of flexible features and a large range of densities up to
10 million system gates, the Virtex-II family enhances programmable
logic design capabilities and is a powerful alternative
to mask-programmed gates arrays. As shown in
Table 1, the Virtex-II family comprises 11 members, ranging
from 40K to 8M system gates.

• Industry First Platform FPGA Solution
• IP-Immersion Architecture
  – Densities from 40K to 8M system gates
  – 420 MHz internal clock speed (Advance Data)
  – 840+ Mb/s I/O (Advance Data)
• SelectRAM™ Memory Hierarchy
  – 3 Mb of dual-port RAM in 18 Kbit block SelectRAM resources
  – Up to 1.5 Mb of distributed SelectRAM resources
• High-Performance Interfaces to External Memory
  – DRAM interfaces
    · Network FCRAM
    · Reduced Latency DRAM
  – SRAM interfaces
    · SDR / DDR SRAM
    · QDR™ SRAM
  – CAM interfaces
• Arithmetic Functions
  – Dedicated 18-bit x 18-bit multiplier blocks
  – Fast look-ahead carry logic chains
• Flexible Logic Resources
  – Up to 93,184 internal registers / latches with Clock Enable
  – Up to 93,184 look-up tables (LUTs) or cascadable 16-bit shift registers
  – Wide multiplexers and wide-input function support
  – Horizontal cascade chain and sum-of-products support

  – Internal 3-state bussing
• High-Performance Clock Management Circuitry
  – Up to 12 DCM (Digital Clock Manager) modules
    · Precise clock de-skew
    · Flexible frequency synthesis
    · High-resolution phase shifting
  – 16 global clock multiplexer buffers
• Active Interconnect Technology
  – Fourth generation segmented routing structure
  – Predictable, fast routing delay, independent of fanout
• SelectIO™-Ultra Technology
  – Up to 1,108 user I/Os
  – 19 single-ended and six differential standards
  – Programmable sink current (2 mA to 24 mA) per I/O
  – Digitally Controlled Impedance (DCI) I/O: on-chip termination resistors for single-ended I/O standards

  – PCI-X compatible (133 MHz and 66 MHz) at 3.3V
  – PCI compliant (66 MHz and 33 MHz) at 3.3V
  – CardBus compliant (33 MHz) at 3.3V
  – Differential Signaling
    · 840 Mb/s Low-Voltage Differential Signaling I/O (LVDS) with current mode drivers
    · Bus LVDS I/O
    · Lightning Data Transport (LDT) I/O with current driver buffers
    · Low-Voltage Positive Emitter-Coupled Logic (LVPECL) I/O
    · Built-in DDR input and output registers
  – Proprietary high-performance SelectLink Technology
    · High-bandwidth data path
    · Double Data Rate (DDR) link
    · Web-based HDL generation methodology
• Supported by Xilinx Foundation™ and Alliance Series™ Development Systems
  – Integrated VHDL and Verilog design flows
  – Compilation of 10M system gates designs
  – Internet Team Design (ITD) tool
• SRAM-Based In-System Configuration
  – Fast SelectMAP configuration
  – Triple Data Encryption Standard (DES) security option (Bitstream Encryption)
  – IEEE 1532 support
  – Partial reconfiguration
  – Unlimited reprogrammability
  – Readback capability
• 0.15 µm 8-Layer Metal Process with 0.12 µm High-Speed Transistors
• 1.5V (VCCINT) Core Power Supply, Dedicated 3.3V VCCAUX Auxiliary and VCCO I/O Power Supplies
• IEEE 1149.1 Compatible Boundary-Scan Logic Support
• Flip-Chip and Wire-Bond Ball Grid Array (BGA)Packages in Three Standard Fine Pitches (0.80 mm,1.00 mm, and      1.27 mm)
• Wire-Bond BGA Devices Available in Pb-Free Packaging

The Xilinx FPGAs series XC2V1000-5FGG456C is FPGA Virtex-II Family 1.5M Gates 17280 Cells 820MHz 0.15um/0.12um (CMOS) Technology 1.5V, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC2V1000-5FGG456C Tags integrated circuit

1. Virtex-II XC2V1000
2. Xilinx XC2V1000
3. Xilinx Virtex-II development board
4. Virtex-II starter kit
5. Virtex-II evaluation kit
6. XC2V1000 development board
7. XC2V1000 reference design
8. XC2V1000 evaluation board
9. Virtex-II starter kit

Xilinx XC2V1000-5FGG456C TechnicalAttributes

-Mounting Type Surface Mount
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Number of Gates 1000000
-Number of LABs/CLBs 1280
-Supplier Device Package 456-FBGA (23×23)
-Voltage – Supply 1.425V ~ 1.575V
-Number of I/O 324

-Package / Case 456-BBGA
-Total RAM Bits 737280