XC3S1000-4FGG676I ApplicationField
-Artificial Intelligence
-Cloud Computing
-Consumer Electronics
-Industrial Control
-Internet of Things
-Medical Equipment
-Wireless Technology
-5G Technology
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XC3S1000-4FGG676I FAQ Chips
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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Q: Where can I purchase Xilinx XC3S1000 Development Boards, Evaluation Boards, or Spartan-3 FPGA Starter Kit? also provide technical information?
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ICs XC3S1000-4FGG676I Features
• Fast look-ahead carry logic
• Clock skew elimination
• Wide, fast multiplexers
• Up to 520 Kbits of total distributed RAM
• JTAG logic compatible with IEEE 1149.1/1532
• 18 single-ended signal standards
• High resolution phase shifting
• Termination by Digitally Controlled Impedance
• Digital Clock Manager (up to four DCMs)
• Signal swing ranging from 1.14V to 3.465V
• Up to 633 I/O pins
• Abundant logic cells with shift register capability
• Dedicated 18 x 18 multipliers
• 622+ Mb/s data transfer rate per I/O
• Low-cost, high-performance logic solution for high-volume,
• SelectIO interface signaling
• 8 differential I/O standards including LVDS, RSDS
• Logic resources
• Densities up to 74,880 logic cells
• Frequency synthesis
• Up to 1,872 Kbits of total block RAM
• DDR, DDR2 SDRAM support up to 333 Mb/s
• Double Data Rate (DDR) support
• SelectRAM hierarchical memory
consumer-oriented applications
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Xilinx XC3S1000-4FGG676I Overview
The XC3S1000-4FGG676I Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The eight-member family offers densities ranging from 50,000 to 5,000,000 system gates, as shown in Datasheet.The XC3S1000-4FGG676I builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. Numerous enhancements derive from the Virtex-II platform technology. These XC3S1000-4FGG676I FPGA enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XC3S1000-4FGG676I FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection and digital television equipment.The XC3S1000-4FGG676I is a superior alternative to mask programmed ASICs. avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, XC3S1000-4FGG676I FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.
The Xilinx FPGAs (Field Programmable Gate Array) series XC3S1000-4FGG676I is 1000000 SYSTEM GATE 1.2 VOLT FPGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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XC3S1000-4FGG676I Tags integrated circuit
1. XC3S1000 evaluation board
2. Xilinx Spartan-3 FPGA development board
3. Spartan-3 FPGA evaluation kit
4. XC3S1000 development board
5. Spartan-3 FPGA XC3S1000
6. Spartan-3 FPGA starter kit
7. XC3S1000 reference design
8. Xilinx XC3S1000
9. XC3S1000 development board
Xilinx XC3S1000-4FGG676I TechnicalAttributes
-Package / Case 676-BGA
-Number of LABs/CLBs 1920
-Number of Logic Elements/Cells 17280
-Voltage – Supply 1.14V ~ 1.26V
-Supplier Device Package 676-FBGA (27×27)
-Mounting Type Surface Mount
-Total RAM Bits 442368
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of I/O 391
-Number of Gates 1000000