XC3S1000-4FTG256C ApplicationField
-Consumer Electronics
-Medical Equipment
-Cloud Computing
-Internet of Things
-Artificial Intelligence
-Industrial Control
-5G Technology
-Wireless Technology
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XC3S1000-4FTG256C FAQ Chips
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ICs XC3S1000-4FTG256C Features
• Signal swing ranging from 1.14V to 3.465V
• Up to 520 Kbits of total distributed RAM
• SelectIO interface signaling
• High resolution phase shifting
• Double Data Rate (DDR) support
• Dedicated 18 x 18 multipliers
• Termination by Digitally Controlled Impedance
• Clock skew elimination
• 622+ Mb/s data transfer rate per I/O
• Frequency synthesis
• JTAG logic compatible with IEEE 1149.1/1532
• Logic resources
• 8 differential I/O standards including LVDS, RSDS
• 18 single-ended signal standards
consumer-oriented applications
• SelectRAM hierarchical memory
• Low-cost, high-performance logic solution for high-volume,
• Fast look-ahead carry logic
• DDR, DDR2 SDRAM support up to 333 Mb/s
• Abundant logic cells with shift register capability
• Wide, fast multiplexers
• Densities up to 74,880 logic cells
• Up to 1,872 Kbits of total block RAM
• Up to 633 I/O pins
• Digital Clock Manager (up to four DCMs)
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Xilinx XC3S1000-4FTG256C Overview
The XC3S1000-4FTG256C Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The eight-member family offers densities ranging from 50,000 to 5,000,000 system gates, as shown in Datasheet.The XC3S1000-4FTG256C builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. Numerous enhancements derive from the Virtex-II platform technology. These XC3S1000-4FTG256C FPGA enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XC3S1000-4FTG256C FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection and digital television equipment.The XC3S1000-4FTG256C is a superior alternative to mask programmed ASICs. avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, XC3S1000-4FTG256C FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.
The Xilinx electronic devices series XC3S1000-4FTG256C is FPGA Spartan-3 Family 1M Gates 17280 Cells 630MHz 90nm Technology 1.2V , View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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XC3S1000-4FTG256C Tags integrated circuit
1. XC3S1000 evaluation board
2. Spartan-3 FPGA XC3S1000
3. Spartan-3 FPGA starter kit
4. XC3S1000 development board
5. Xilinx XC3S1000
6. XC3S1000 reference design
7. XC3S1000-4FTG256C Datasheet PDF
8. Spartan-3 FPGA evaluation kit
9. XC3S1000 development board
Xilinx XC3S1000-4FTG256C TechnicalAttributes
-Package / Case 256-LBGA
-Number of I/O 173
-Number of Logic Elements/Cells 17280
-Supplier Device Package 256-FTBGA (17×17)
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Number of LABs/CLBs 1920
-Voltage – Supply 1.14V ~ 1.26V
-Mounting Type Surface Mount
-Number of Gates 1000000
-Total RAM Bits 442368